Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness
The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn–10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates (T˙) with a view to investigating t...
Saved in:
Published in | Journal of alloys and compounds Vol. 647; pp. 989 - 996 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
25.10.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn–10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates (T˙) with a view to investigating the corresponding microstructural evolution. The microstructure is shown to be formed mainly by an alternation of Zn-rich plate-like cells and a eutectic mixture. Morphological instabilities of the Zn-rich plates are shown to start for the lower content Zn–10 and 20wt%Sn alloys, however a microstructural transition of these plates into cylindrical-type horizontal cells can only be found in the microstructure of the 30 and 40wt%Sn alloys. Experimental growth laws are proposed relating the microstructural spacing (λ) to solidification thermal parameters. Hardness (HV) is shown be affected by both the positive segregation of Sn, the alloy volumetric fraction of Zn and λ. Hall-Petch type equations are proposed relating HV to λ.
Schematic representation and corresponding SEM sequential images of morphologies of a hypoeutectic Zn–30wt%Sn alloy considering the growth of the α-Zn phase: (a); (d) plate-like aligned cells; (b); (e) wavy lateral instabilities and (c); (f) formation of a sequence of cylinder-like horizontal bars. [Display omitted]
•Plate-like cells become horizontal cylindrical-like cells with increasing Sn content.•For Zn(10; 20%)Sn alloys a –1/4 exponent relates λ to the cooling rate.•For Zn(30; 40%)Sn alloys a –1/2 exponent relates λ to the cooling rate.•Hardness depends on the balance between Sn segregation and λ value for DS Zn–Sn alloys. |
---|---|
AbstractList | The most relevant range of compositions of Zn-Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn-10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates (T) with a view to investigating the corresponding microstructural evolution. The microstructure is shown to be formed mainly by an alternation of Zn-rich plate-like cells and a eutectic mixture. Morphological instabilities of the Zn-rich plates are shown to start for the lower content Zn-10 and 20wt%Sn alloys, however a microstructural transition of these plates into cylindrical-type horizontal cells can only be found in the microstructure of the 30 and 40wt%Sn alloys. Experimental growth laws are proposed relating the microstructural spacing ([lambda]) to solidification thermal parameters. Hardness (HV) is shown be affected by both the positive segregation of Sn, the alloy volumetric fraction of Zn and [lambda]. Hall-Petch type equations are proposed relating HV to [lambda]. The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn–10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates (T˙) with a view to investigating the corresponding microstructural evolution. The microstructure is shown to be formed mainly by an alternation of Zn-rich plate-like cells and a eutectic mixture. Morphological instabilities of the Zn-rich plates are shown to start for the lower content Zn–10 and 20wt%Sn alloys, however a microstructural transition of these plates into cylindrical-type horizontal cells can only be found in the microstructure of the 30 and 40wt%Sn alloys. Experimental growth laws are proposed relating the microstructural spacing (λ) to solidification thermal parameters. Hardness (HV) is shown be affected by both the positive segregation of Sn, the alloy volumetric fraction of Zn and λ. Hall-Petch type equations are proposed relating HV to λ. Schematic representation and corresponding SEM sequential images of morphologies of a hypoeutectic Zn–30wt%Sn alloy considering the growth of the α-Zn phase: (a); (d) plate-like aligned cells; (b); (e) wavy lateral instabilities and (c); (f) formation of a sequence of cylinder-like horizontal bars. [Display omitted] •Plate-like cells become horizontal cylindrical-like cells with increasing Sn content.•For Zn(10; 20%)Sn alloys a –1/4 exponent relates λ to the cooling rate.•For Zn(30; 40%)Sn alloys a –1/2 exponent relates λ to the cooling rate.•Hardness depends on the balance between Sn segregation and λ value for DS Zn–Sn alloys. |
Author | Bertelli, Felipe Spinelli, José E. Garcia, Amauri Santos, Washington L.R. Brito, Crystopher |
Author_xml | – sequence: 1 givenname: Washington L.R. surname: Santos fullname: Santos, Washington L.R. organization: Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083 – 970 Campinas, SP, Brazil – sequence: 2 givenname: Crystopher surname: Brito fullname: Brito, Crystopher organization: Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083 – 970 Campinas, SP, Brazil – sequence: 3 givenname: Felipe surname: Bertelli fullname: Bertelli, Felipe organization: Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083 – 970 Campinas, SP, Brazil – sequence: 4 givenname: José E. surname: Spinelli fullname: Spinelli, José E. email: spinelli@ufscar.br organization: Department of Materials Engineering, Federal University of São Carlos – UFSCar, 13565-905 São Carlos, São Paulo, Brazil – sequence: 5 givenname: Amauri surname: Garcia fullname: Garcia, Amauri organization: Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083 – 970 Campinas, SP, Brazil |
BookMark | eNqFkb1uHCEURlFkS1nbeYRINJGcYiYwDLOMUkSRlT_JVookTRrEwp1dVgxMgLG1Xd4hTZ7PTxLG6yqNG0DoO_deOGfoxAcPCL2kpKaEdm_29V45p8NYN4TymvCa9vwZWlGxZlXbdf0JWpG-4ZVgQjxHZyntCSG0Z3SF_t5YHUPKcdZ5jsphA7fgwjSCzzgMeHeYAswZdLYa__T3v_9cUlLWlry-y6--eZyCMxBxGSAcElbeYDtOSue00NZniNNOJcCpXFq_fUiMaukJ2whblW3weFK5BD0ux52KxkNKF-h0UC7Bi8f9HP34-OH71efq-uunL1fvryvN2iZXTCtgnGjRNpuGt5ptqDAt7xiYDgZFh3atmoFp2jVmUIQLLTZ0IIIIbpRhmp2jy2PdKYZfM6QsR5s0OKc8hDlJuu5Z0zaCkhJ9e4wu06cIg9Q2PzwgR2WdpEQuPuRePvqQiw9JuCw-Cs3_o6doRxUPT3LvjhyUX7i1EGXSFrwGY2PRIk2wT1T4B1-1sGI |
CitedBy_id | crossref_primary_10_1016_j_jallcom_2015_11_117 crossref_primary_10_1007_s10854_023_11099_x crossref_primary_10_1007_s11661_016_3494_7 crossref_primary_10_1007_s42243_020_00365_5 crossref_primary_10_1016_j_jmrt_2020_03_013 crossref_primary_10_1016_j_msea_2019_138323 crossref_primary_10_1002_adem_202401074 crossref_primary_10_1134_S2075113321040407 crossref_primary_10_1016_j_applthermaleng_2016_06_177 crossref_primary_10_1016_j_jallcom_2016_09_003 crossref_primary_10_1007_s10854_018_9176_z crossref_primary_10_33581_2520_2243_2021_2_44_52 crossref_primary_10_1016_j_matchar_2023_113337 crossref_primary_10_1007_s10854_020_04466_5 crossref_primary_10_1016_j_jmst_2021_01_058 crossref_primary_10_1007_s10854_018_9956_5 crossref_primary_10_1016_j_msea_2019_02_053 crossref_primary_10_1088_2053_1591_ab24f2 crossref_primary_10_1016_j_jallcom_2020_154812 crossref_primary_10_1016_j_microrel_2017_12_029 crossref_primary_10_1002_adem_202201270 crossref_primary_10_1016_j_matchar_2021_110936 crossref_primary_10_1007_s10853_019_04148_6 crossref_primary_10_1016_j_matchar_2023_112977 crossref_primary_10_1007_s10854_018_0352_y crossref_primary_10_1557_adv_2017_610 |
Cites_doi | 10.1080/14786435.2010.545779 10.1016/j.jallcom.2008.03.026 10.1007/s11664-008-0550-0 10.1016/S0921-5093(01)01649-5 10.1007/s11661-008-9542-1 10.1007/s10854-013-1612-5 10.1016/j.matchemphys.2013.11.030 10.1007/s10854-010-0279-4 10.1007/s11661-008-9536-z 10.1016/j.corsci.2012.05.006 10.2320/matertrans.48.1105 10.1016/S1468-6996(01)00038-9 10.1007/s11664-013-2653-5 10.2320/matertrans.48.584 10.1016/S0921-5093(02)00581-6 10.1016/j.matchemphys.2012.03.057 10.1016/j.matlet.2012.04.095 10.1016/j.microrel.2012.02.018 10.1016/S1359-6454(01)00321-4 10.1016/j.jallcom.2010.07.160 10.1007/s11664-010-1233-1 10.1016/j.mee.2010.12.072 10.1016/j.jallcom.2008.07.021 10.1016/j.msea.2004.01.022 10.1016/j.mseb.2013.11.016 10.1016/S1359-6454(99)00365-1 |
ContentType | Journal Article |
Copyright | 2015 Elsevier B.V. |
Copyright_xml | – notice: 2015 Elsevier B.V. |
DBID | AAYXX CITATION 8BQ 8FD JG9 |
DOI | 10.1016/j.jallcom.2015.05.195 |
DatabaseName | CrossRef METADEX Technology Research Database Materials Research Database |
DatabaseTitle | CrossRef Materials Research Database Technology Research Database METADEX |
DatabaseTitleList | Materials Research Database |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Chemistry Physics |
EISSN | 1873-4669 |
EndPage | 996 |
ExternalDocumentID | 10_1016_j_jallcom_2015_05_195 S0925838815300943 |
GroupedDBID | --K --M -~X .~1 0R~ 1B1 1~. 1~5 4.4 457 4G. 5GY 5VS 7-5 71M 8P~ 9JN AABNK AABXZ AACTN AAEDT AAEDW AAEPC AAIAV AAIKJ AAKOC AALRI AAOAW AAQFI AAXUO ABFNM ABJNI ABMAC ABXRA ABYKQ ACDAQ ACGFS ACIWK ACNCT ACRLP ADBBV ADEZE AEBSH AEKER AENEX AEZYN AFKWA AFRZQ AFTJW AGHFR AGUBO AGYEJ AHHHB AIEXJ AIKHN AITUG AJBFU AJOXV ALMA_UNASSIGNED_HOLDINGS AMFUW AMRAJ AXJTR BKOJK BLXMC CS3 DU5 EBS EFJIC EFLBG EJD EO8 EO9 EP2 EP3 F5P FDB FIRID FNPLU FYGXN G-Q GBLVA IHE J1W KOM M24 M41 MAGPM MO0 N9A O-L O9- OAUVE OZT P-8 P-9 P2P PC. Q38 RIG RNS ROL RPZ SDF SDG SES SPC SPCBC SPD SSM SSZ T5K TWZ XPP ZMT ~G- 29J AAQXK AATTM AAXKI AAYWO AAYXX ABWVN ABXDB ACNNM ACRPL ACVFH ADCNI ADMUD ADNMO AEIPS AEUPX AFJKZ AFPUW AGCQF AGQPQ AGRNS AIGII AIIUN AKBMS AKRWK AKYEP ANKPU APXCP ASPBG AVWKF AZFZN BNPGV CITATION FEDTE FGOYB G-2 HVGLF HZ~ R2- SEW SMS SSH T9H WUQ 8BQ 8FD AFXIZ EFKBS JG9 |
ID | FETCH-LOGICAL-c342t-3cae350c842b254c3b18d4563ed6efa1f47a2f3c162dfa058c8b1f08085dad3c3 |
IEDL.DBID | .~1 |
ISSN | 0925-8388 |
IngestDate | Wed Jul 30 11:17:27 EDT 2025 Tue Jul 01 02:08:48 EDT 2025 Thu Apr 24 22:56:55 EDT 2025 Fri Feb 23 02:26:53 EST 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Keywords | Microstructure Hardness Zn–Sn solders Solidification |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c342t-3cae350c842b254c3b18d4563ed6efa1f47a2f3c162dfa058c8b1f08085dad3c3 |
Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
PQID | 1793242810 |
PQPubID | 23500 |
PageCount | 8 |
ParticipantIDs | proquest_miscellaneous_1793242810 crossref_citationtrail_10_1016_j_jallcom_2015_05_195 crossref_primary_10_1016_j_jallcom_2015_05_195 elsevier_sciencedirect_doi_10_1016_j_jallcom_2015_05_195 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2015-10-25 |
PublicationDateYYYYMMDD | 2015-10-25 |
PublicationDate_xml | – month: 10 year: 2015 text: 2015-10-25 day: 25 |
PublicationDecade | 2010 |
PublicationTitle | Journal of alloys and compounds |
PublicationYear | 2015 |
Publisher | Elsevier B.V |
Publisher_xml | – name: Elsevier B.V |
References | Che, Zhu, Poh, Zhang, Zhang (bib12) 2010; 507 Spinelli, Garcia (bib14) 2014; 25 Santos, Brito, Quaresma, Spinelli, Garcia (bib11) 2014; 182 Wang, Chen, Li (bib1) 2012; 136 Dias, Brito, Bertelli, Garcia (bib15) 2014; 143 Takahashi, Komatsu, Nishikawa, Takemoto (bib5) 2010; 39 Song, Lin, Hsieh, Pai, Lai, Chiu (bib7) 2013; 42 Goulart, Cruz, Spinelli, Ferreira, Cheung, Garcia (bib20) 2009; 470 Kim, Kim, Kim, Suganuma (bib8) 2009; 38 Brito, Siqueira, Spinelli, Garcia (bib25) 2012; 80 Mahmudi, Eslami (bib6) 2011; 22 Rosa, Spinelli, Ferreira, Garcia (bib19) 2008; 39 Ma, Li, NG, Jones (bib22) 2001; 2 Chidambaram, Hattel, Hald (bib2) 2011; 88 Spinelli, Cheung, Garcia (bib28) 2011; 91 Ma, Li, NG, Jones (bib21) 2000; 48 Matsugi, Sasaki, Yanagisawa, Kumagai, Fujii (bib9) 2007; 48 Rocha, Siqueira, Garcia (bib27) 2003; 347 Lee, Kim, Suganuma, Inoue, Izuta (bib10) 2007; 48 Gunduz, Çardili (bib18) 2002; 327 Jackson, Hunt (bib26) 1966; 236 Xu, Feng, Li, Zhang, Li (bib23) 2002; 50 Wang, Wang, Feng, Ke (bib13) 2012; 63 Canté, Spinelli, Ferreira, Cheung, Garcia (bib17) 2008; 39 Zeng, McDonald, Nogita (bib3) 2012; 52 Musa, Salleh, Saud (bib4) 2013; 795 Xu, Feng, Li, Li (bib24) 2004; 373 Silva, Spinelli, Garcia (bib16) 2009; 475 Gunduz (10.1016/j.jallcom.2015.05.195_bib18) 2002; 327 Ma (10.1016/j.jallcom.2015.05.195_bib21) 2000; 48 Musa (10.1016/j.jallcom.2015.05.195_bib4) 2013; 795 Spinelli (10.1016/j.jallcom.2015.05.195_bib14) 2014; 25 Ma (10.1016/j.jallcom.2015.05.195_bib22) 2001; 2 Xu (10.1016/j.jallcom.2015.05.195_bib24) 2004; 373 Song (10.1016/j.jallcom.2015.05.195_bib7) 2013; 42 Che (10.1016/j.jallcom.2015.05.195_bib12) 2010; 507 Zeng (10.1016/j.jallcom.2015.05.195_bib3) 2012; 52 Canté (10.1016/j.jallcom.2015.05.195_bib17) 2008; 39 Santos (10.1016/j.jallcom.2015.05.195_bib11) 2014; 182 Silva (10.1016/j.jallcom.2015.05.195_bib16) 2009; 475 Wang (10.1016/j.jallcom.2015.05.195_bib1) 2012; 136 Dias (10.1016/j.jallcom.2015.05.195_bib15) 2014; 143 Xu (10.1016/j.jallcom.2015.05.195_bib23) 2002; 50 Kim (10.1016/j.jallcom.2015.05.195_bib8) 2009; 38 Chidambaram (10.1016/j.jallcom.2015.05.195_bib2) 2011; 88 Rocha (10.1016/j.jallcom.2015.05.195_bib27) 2003; 347 Lee (10.1016/j.jallcom.2015.05.195_bib10) 2007; 48 Wang (10.1016/j.jallcom.2015.05.195_bib13) 2012; 63 Jackson (10.1016/j.jallcom.2015.05.195_bib26) 1966; 236 Spinelli (10.1016/j.jallcom.2015.05.195_bib28) 2011; 91 Matsugi (10.1016/j.jallcom.2015.05.195_bib9) 2007; 48 Takahashi (10.1016/j.jallcom.2015.05.195_bib5) 2010; 39 Rosa (10.1016/j.jallcom.2015.05.195_bib19) 2008; 39 Goulart (10.1016/j.jallcom.2015.05.195_bib20) 2009; 470 Brito (10.1016/j.jallcom.2015.05.195_bib25) 2012; 80 Mahmudi (10.1016/j.jallcom.2015.05.195_bib6) 2011; 22 |
References_xml | – volume: 88 start-page: 981 year: 2011 end-page: 989 ident: bib2 article-title: High temperature lead-free solder alternatives publication-title: Microelectron. Eng. – volume: 25 start-page: 478 year: 2014 end-page: 486 ident: bib14 article-title: Development of solidification microstructure and tensile mechanical properties of Sn–0.7Cu and Sn–0.7Cu–2.0Ag solders publication-title: J. Mater. Sci. Mater. Electron – volume: 80 start-page: 106 year: 2012 end-page: 109 ident: bib25 article-title: Effects of cell morphology and macrosegregation of directionally solidified Zn-rich Zn–cu alloys on the resulting microhardness publication-title: Mater. Lett. – volume: 38 start-page: 266 year: 2009 end-page: 272 ident: bib8 article-title: Interfacial reaction and die attach properties of Zn–Sn high-temperature solders publication-title: J. Electron Mater. – volume: 48 start-page: 584 year: 2007 end-page: 593 ident: bib10 article-title: Thermal properties and phase stability of Zn–Sn and Zn–In alloys as high temperature lead-free solder publication-title: Mater. Trans. – volume: 39 start-page: 2161 year: 2008 end-page: 2174 ident: bib19 article-title: Cellular/dendritic transition and microstructure evolution during transient directional solidification of Pb–Sb alloys publication-title: Metall. Mater. Trans. A – volume: 182 start-page: 29 year: 2014 end-page: 36 ident: bib11 article-title: Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy publication-title: Mat. Sci. Eng. B – volume: 50 start-page: 183 year: 2002 end-page: 193 ident: bib23 article-title: Rapid solidification behavior of Zn-rich Zn–Ag peritectic alloys publication-title: Acta Mater. – volume: 39 start-page: 1241 year: 2010 end-page: 1247 ident: bib5 article-title: Improvement of high-temperature performance of Zn-Sn solder joint publication-title: J. Electron Mater. – volume: 63 start-page: 20 year: 2012 end-page: 28 ident: bib13 article-title: Effect of Ag publication-title: Corros. Sci. – volume: 327 start-page: 167 year: 2002 end-page: 185 ident: bib18 article-title: Directional solidification of aluminium–copper alloys publication-title: Mater. Sci. Eng. A – volume: 143 start-page: 895 year: 2014 end-page: 899 ident: bib15 article-title: Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified publication-title: Mater. Chem. Phys. – volume: 91 start-page: 1705 year: 2011 end-page: 1723 ident: bib28 article-title: On array models theoretical predictions versus measurements for the growth of cells and dendrites in the transient solidification of binary alloys publication-title: Philos. Mag. – volume: 507 start-page: 215 year: 2010 end-page: 224 ident: bib12 article-title: The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures publication-title: J. Alloy. Compd. – volume: 2 start-page: 127 year: 2001 end-page: 130 ident: bib22 article-title: Unidirectional solidification of a Zn-rich Zn-2.17 wt%Cu hypo-peritectic alloy publication-title: Sci. Technol. Adv. Mater. – volume: 42 start-page: 2813 year: 2013 end-page: 2821 ident: bib7 article-title: Ball impact reliabilityof Zn–Sn high-temperature solder joints bonded with different substrates publication-title: J. Electron Mater. – volume: 48 start-page: 419 year: 2000 end-page: 431 ident: bib21 article-title: Unidirectional solidification of Zn-rich Zn–Cu peritectic alloys – I. Microstructure selection publication-title: Acta Mater. – volume: 52 start-page: 1306 year: 2012 end-page: 1322 ident: bib3 article-title: Development of high-temperature solders: review publication-title: Microelectron. Reliab – volume: 39 start-page: 1712 year: 2008 end-page: 1726 ident: bib17 article-title: Microstructural development in Al–Ni alloys directionally solidified under unsteady-state conditions publication-title: Metall. Mater. Trans. A – volume: 373 start-page: 139 year: 2004 end-page: 145 ident: bib24 article-title: Cellular growth of Zn-rich Zn–Ag alloys processed by rapid solidification publication-title: Mater. Sci. Eng. A – volume: 795 start-page: 518 year: 2013 end-page: 521 ident: bib4 article-title: Zn-based high temperature solder – a short review publication-title: Adv. Mat. Res. – volume: 236 start-page: 1129 year: 1966 end-page: 1142 ident: bib26 article-title: Lamellar and rod eutectic growth publication-title: Trans. Metall. Soc. AIME – volume: 136 start-page: 325 year: 2012 end-page: 333 ident: bib1 article-title: Interfacial reactions of high-temperature Zn–Sn solders with Ni substrate publication-title: Mater. Chem. Phys. – volume: 347 start-page: 59 year: 2003 end-page: 69 ident: bib27 article-title: Cellular/dendritic transition during unsteady-state unidirectional solidification of Sn–Pb alloys publication-title: Mater. Sci. Eng. A – volume: 48 start-page: 1105 year: 2007 end-page: 1112 ident: bib9 article-title: Electrical and thermal characteristics of Pb-free Sn–Zn alloys for an AC-low voltage fuse element publication-title: Mater. Trans. – volume: 22 start-page: 1168 year: 2011 end-page: 1172 ident: bib6 article-title: Shear strength of the Zn-Sn high-temperature lead-free solders publication-title: J. Mater. Sci. Mater. Electron – volume: 470 start-page: 589 year: 2009 end-page: 599 ident: bib20 article-title: Cellular growth during transient solidification of hypoeutectic Al–Fe alloys publication-title: J. Alloy. Compd. – volume: 475 start-page: 347 year: 2009 end-page: 351 ident: bib16 article-title: Thermal parameters and microstructure during transient directional solidification of a monotectic Al–Bi alloy publication-title: J. Alloy. Compd. – volume: 236 start-page: 1129 year: 1966 ident: 10.1016/j.jallcom.2015.05.195_bib26 article-title: Lamellar and rod eutectic growth publication-title: Trans. Metall. Soc. AIME – volume: 91 start-page: 1705 year: 2011 ident: 10.1016/j.jallcom.2015.05.195_bib28 article-title: On array models theoretical predictions versus measurements for the growth of cells and dendrites in the transient solidification of binary alloys publication-title: Philos. Mag. doi: 10.1080/14786435.2010.545779 – volume: 470 start-page: 589 year: 2009 ident: 10.1016/j.jallcom.2015.05.195_bib20 article-title: Cellular growth during transient solidification of hypoeutectic Al–Fe alloys publication-title: J. Alloy. Compd. doi: 10.1016/j.jallcom.2008.03.026 – volume: 38 start-page: 266 year: 2009 ident: 10.1016/j.jallcom.2015.05.195_bib8 article-title: Interfacial reaction and die attach properties of Zn–Sn high-temperature solders publication-title: J. Electron Mater. doi: 10.1007/s11664-008-0550-0 – volume: 327 start-page: 167 year: 2002 ident: 10.1016/j.jallcom.2015.05.195_bib18 article-title: Directional solidification of aluminium–copper alloys publication-title: Mater. Sci. Eng. A doi: 10.1016/S0921-5093(01)01649-5 – volume: 39 start-page: 2161 year: 2008 ident: 10.1016/j.jallcom.2015.05.195_bib19 article-title: Cellular/dendritic transition and microstructure evolution during transient directional solidification of Pb–Sb alloys publication-title: Metall. Mater. Trans. A doi: 10.1007/s11661-008-9542-1 – volume: 25 start-page: 478 year: 2014 ident: 10.1016/j.jallcom.2015.05.195_bib14 article-title: Development of solidification microstructure and tensile mechanical properties of Sn–0.7Cu and Sn–0.7Cu–2.0Ag solders publication-title: J. Mater. Sci. Mater. Electron doi: 10.1007/s10854-013-1612-5 – volume: 143 start-page: 895 year: 2014 ident: 10.1016/j.jallcom.2015.05.195_bib15 article-title: Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified publication-title: Mater. Chem. Phys. doi: 10.1016/j.matchemphys.2013.11.030 – volume: 22 start-page: 1168 year: 2011 ident: 10.1016/j.jallcom.2015.05.195_bib6 article-title: Shear strength of the Zn-Sn high-temperature lead-free solders publication-title: J. Mater. Sci. Mater. Electron doi: 10.1007/s10854-010-0279-4 – volume: 39 start-page: 1712 year: 2008 ident: 10.1016/j.jallcom.2015.05.195_bib17 article-title: Microstructural development in Al–Ni alloys directionally solidified under unsteady-state conditions publication-title: Metall. Mater. Trans. A doi: 10.1007/s11661-008-9536-z – volume: 63 start-page: 20 year: 2012 ident: 10.1016/j.jallcom.2015.05.195_bib13 article-title: Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition publication-title: Corros. Sci. doi: 10.1016/j.corsci.2012.05.006 – volume: 48 start-page: 1105 year: 2007 ident: 10.1016/j.jallcom.2015.05.195_bib9 article-title: Electrical and thermal characteristics of Pb-free Sn–Zn alloys for an AC-low voltage fuse element publication-title: Mater. Trans. doi: 10.2320/matertrans.48.1105 – volume: 2 start-page: 127 year: 2001 ident: 10.1016/j.jallcom.2015.05.195_bib22 article-title: Unidirectional solidification of a Zn-rich Zn-2.17 wt%Cu hypo-peritectic alloy publication-title: Sci. Technol. Adv. Mater. doi: 10.1016/S1468-6996(01)00038-9 – volume: 42 start-page: 2813 year: 2013 ident: 10.1016/j.jallcom.2015.05.195_bib7 article-title: Ball impact reliabilityof Zn–Sn high-temperature solder joints bonded with different substrates publication-title: J. Electron Mater. doi: 10.1007/s11664-013-2653-5 – volume: 48 start-page: 584 year: 2007 ident: 10.1016/j.jallcom.2015.05.195_bib10 article-title: Thermal properties and phase stability of Zn–Sn and Zn–In alloys as high temperature lead-free solder publication-title: Mater. Trans. doi: 10.2320/matertrans.48.584 – volume: 347 start-page: 59 year: 2003 ident: 10.1016/j.jallcom.2015.05.195_bib27 article-title: Cellular/dendritic transition during unsteady-state unidirectional solidification of Sn–Pb alloys publication-title: Mater. Sci. Eng. A doi: 10.1016/S0921-5093(02)00581-6 – volume: 136 start-page: 325 year: 2012 ident: 10.1016/j.jallcom.2015.05.195_bib1 article-title: Interfacial reactions of high-temperature Zn–Sn solders with Ni substrate publication-title: Mater. Chem. Phys. doi: 10.1016/j.matchemphys.2012.03.057 – volume: 80 start-page: 106 year: 2012 ident: 10.1016/j.jallcom.2015.05.195_bib25 article-title: Effects of cell morphology and macrosegregation of directionally solidified Zn-rich Zn–cu alloys on the resulting microhardness publication-title: Mater. Lett. doi: 10.1016/j.matlet.2012.04.095 – volume: 52 start-page: 1306 year: 2012 ident: 10.1016/j.jallcom.2015.05.195_bib3 article-title: Development of high-temperature solders: review publication-title: Microelectron. Reliab doi: 10.1016/j.microrel.2012.02.018 – volume: 50 start-page: 183 year: 2002 ident: 10.1016/j.jallcom.2015.05.195_bib23 article-title: Rapid solidification behavior of Zn-rich Zn–Ag peritectic alloys publication-title: Acta Mater. doi: 10.1016/S1359-6454(01)00321-4 – volume: 507 start-page: 215 year: 2010 ident: 10.1016/j.jallcom.2015.05.195_bib12 article-title: The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures publication-title: J. Alloy. Compd. doi: 10.1016/j.jallcom.2010.07.160 – volume: 39 start-page: 1241 year: 2010 ident: 10.1016/j.jallcom.2015.05.195_bib5 article-title: Improvement of high-temperature performance of Zn-Sn solder joint publication-title: J. Electron Mater. doi: 10.1007/s11664-010-1233-1 – volume: 88 start-page: 981 year: 2011 ident: 10.1016/j.jallcom.2015.05.195_bib2 article-title: High temperature lead-free solder alternatives publication-title: Microelectron. Eng. doi: 10.1016/j.mee.2010.12.072 – volume: 475 start-page: 347 year: 2009 ident: 10.1016/j.jallcom.2015.05.195_bib16 article-title: Thermal parameters and microstructure during transient directional solidification of a monotectic Al–Bi alloy publication-title: J. Alloy. Compd. doi: 10.1016/j.jallcom.2008.07.021 – volume: 373 start-page: 139 year: 2004 ident: 10.1016/j.jallcom.2015.05.195_bib24 article-title: Cellular growth of Zn-rich Zn–Ag alloys processed by rapid solidification publication-title: Mater. Sci. Eng. A doi: 10.1016/j.msea.2004.01.022 – volume: 182 start-page: 29 year: 2014 ident: 10.1016/j.jallcom.2015.05.195_bib11 article-title: Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy publication-title: Mat. Sci. Eng. B doi: 10.1016/j.mseb.2013.11.016 – volume: 48 start-page: 419 year: 2000 ident: 10.1016/j.jallcom.2015.05.195_bib21 article-title: Unidirectional solidification of Zn-rich Zn–Cu peritectic alloys – I. Microstructure selection publication-title: Acta Mater. doi: 10.1016/S1359-6454(99)00365-1 – volume: 795 start-page: 518 year: 2013 ident: 10.1016/j.jallcom.2015.05.195_bib4 article-title: Zn-based high temperature solder – a short review publication-title: Adv. Mat. Res. |
SSID | ssj0001931 |
Score | 2.319483 |
Snippet | The most relevant range of compositions of Zn–Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification... The most relevant range of compositions of Zn-Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification... |
SourceID | proquest crossref elsevier |
SourceType | Aggregation Database Enrichment Source Index Database Publisher |
StartPage | 989 |
SubjectTerms | Alloys Hardness Mathematical analysis Microstructure Plates Solders Solidification Zinc Zinc base alloys Zn–Sn solders |
Title | Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness |
URI | https://dx.doi.org/10.1016/j.jallcom.2015.05.195 https://www.proquest.com/docview/1793242810 |
Volume | 647 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1fa9RAEF9KpagPYk-lrVpWUNCH3G2ym9zeYzks15b2pRaKL8vsn7R3XHOHd6X0RfwOvvj5_CTObBJPi1DwJSRhJwmZyfzJ_GaGsbdgC-19gRyQ_SxRpbCJVc4moIUToK23QP87jk-K0Zk6PM_P19iwrYUhWGWj-2udHrV1c6bXvM3efDzunYpBRjk_jd9sxMdRBbvqk5R3v65gHuigxKl5uDih1asqnt6kO4HplEAjaAVzauCZ0piJf9unO5o6mp_9p-xJ4zfyvfrRNtlaqDrs4bAd19Zhj__oLNhhGxHZ6RbP2I9jgtzVbWKpxQb3K5gQn5X88nY-C9eUShg7_rn6-e37-1TgVokPN8t3pxVH4fThC6cE_e2CQ-V5XVm5IOpxxCxeoinkqJoc3juuuAK6Z8BY_iJyns9jG8-K4y6VeZF-fc7O9j9-Go6SZhxD4qTKlol0EGQunFaZxbDSSZtqj_6XDL4IJaSl6kNWSpcWmS9B5Nppm5bokercg5dOvmDr1awKW4wHDJwKVYSQB6kGGnQGqXKgAcqBw5B0m6mWCcY1vcppZMbUtKC0iWl4Z4h3RuQGebfNur_J5nWzjvsIdMth85fUGTQo95G-aSXCIKcpzQJVmF0vDKk8dHx0Knb-__Iv2SM6IiuZ5a_YOkpJeI3uz9LuRvneZQ_2Do5GJ78As8cLPw |
linkProvider | Elsevier |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1Lb9NAEB6VVKhwQBBAtLwWCSQ4uFl71-7mWEVUKW1yaStVXFb7cpsoOFGTCvXGf-DC7-OXMLO2W0BIlbhYlu3xWv7G8_C8AN4aWyjvC0RA7GSJLLlNrHQ2MYo7bpT11tD_jtG4GJ7IT6f56RoM2loYSqtsZH8t06O0bo70mrfZW0wmvSPezyjmp_Cbjflxd2CdulPlHVjf3T8Yjq8FMtoocXAeXp8QwU0hT2-6PTWzGeWNoCLMqYdnSpMm_q2i_hLWUQPtPYQHjenIduunewRroerCxqCd2NaF-781F-zC3Zjc6ZaP4ceIsu7qTrHUZYP5m0whNi_Z-dViHi4pmjBx7HP189v39ynHreQfvq7eHVUM-dOHC0Yx-qslM5VndXHlkqgnMW3xHLUhQ-nkcO14xRdDawZ0588i-GwRO3lWDHep0otE7BM42ft4PBgmzUSGxAmZrRLhTBA5d0pmFj1LJ2yqPJpgIvgilCYt5Y7JSuHSIvOl4blyyqYlGqUq98YLJ55Cp5pX4RmwgL5TIYsQ8iBkXxmVmVQ6o4wp-w690k2QLQjaNe3KaWrGTLd5aVPdYKcJO81zjdhtwvY12aLu13EbgWoR1n8wnkadchvpm5YjNCJNkRZThfnlUpPUQ9tHpXzr_2__GjaGx6NDfbg_PngO9-gMKc0sfwEd5JjwEq2hlX3VcPsvxAAN8A |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Microstructural+development+of+hypoeutectic+Zn%E2%80%93%2810%E2%80%9340%29wt%25Sn+solder+alloys+and+impacts+of+interphase+spacing+and+macrosegregation+pattern+on+hardness&rft.jtitle=Journal+of+alloys+and+compounds&rft.au=Santos%2C+Washington+L.R.&rft.au=Brito%2C+Crystopher&rft.au=Bertelli%2C+Felipe&rft.au=Spinelli%2C+Jos%C3%A9+E.&rft.date=2015-10-25&rft.issn=0925-8388&rft.volume=647&rft.spage=989&rft.epage=996&rft_id=info:doi/10.1016%2Fj.jallcom.2015.05.195&rft.externalDBID=n%2Fa&rft.externalDocID=10_1016_j_jallcom_2015_05_195 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0925-8388&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0925-8388&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0925-8388&client=summon |