Studies on thermal stability, mechanical and electrical properties of nano crystalline Cu99.5Zr0.5 alloy

• Published in: Journal of alloys and compounds Vol. 558; pp. 44 - 49
• Main Authors: Roy, Debdas, Atwater, Mark A., Youssef, Khaled, Ledford, John Christopher, Scattergood, Ronald O., Koch, Carl C.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 05.05.2013; Elsevier
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Cryomilling; Electrical resistivity; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronic transport in multilayers, nanoscale materials and structures; Exact sciences and technology; Materials science; Mechanical and acoustical properties of condensed matter; Mechanical properties of nanoscale materials; Nanocrystalline; Nanocrystalline materials; Nanoscale materials and structures: fabrication and characterization; Physics; Shear stress; Thermal stabilization; Shear stress; Thermal stabilization; Cryomilling; Electrical resistivity; Nanocrystalline; Grain size; Densification; Ball mill; Doping; Shear strength; XRD; Mechanical alloying; Thermal stability; Zirconium additions; Hot pressing; Transmission electron microscopy; Transition elements; Copper; Microstructure; Nanocrystal
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2012.11.004

[Display omitted] ► 0.5at.% of Zr addition is an excellent candidate for stabilizing nanocrystalline Cu. ► The Cu99.5Zr0.5 alloy shows better mechanical properties than nanocrystalline Cu after hot-pressing at 550°C. ► However, electrical resistivity is higher than nanocrystalline Cu. Cryogenic high energy ball milling was used to synthesize nanocrystalline Cu and Cu99.5Zr0.5 alloys by mechanical alloying and consolidation by hot pressing at 550°C temperature. The grain size stability of nanocrystalline Cu is improved by the Zr addition. Microstructural characterization using X-ray diffraction and transmission electron microscopy provided evidence for the formation of a Cu–Zr alloy solid solution with nanocrystalline size after hot pressing. The alloy exhibited a higher hardness (3.31GPa), and shear strength (550MPa) than nano-crystalline pure Cu however, the electrical resistivity is increased in the alloy.