Nonaqueous Halide-Free Flux Reactions with Tin-Based Solders
New halide-free fluxes are becoming more prevalent in electronic packaging; however, their efficacy and reactive behavior with conventional solders has not been well characterized. In this work, we examine nonaqueous halide-free flux reactions of tin (Sn)-based solder surfaces using electrochemical...
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Published in | Journal of electronic materials Vol. 44; no. 4; pp. 1144 - 1150 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Boston
Springer US
01.04.2015
Springer Nature B.V |
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Abstract | New halide-free fluxes are becoming more prevalent in electronic packaging; however, their efficacy and reactive behavior with conventional solders has not been well characterized. In this work, we examine nonaqueous halide-free flux reactions of tin (Sn)-based solder surfaces using electrochemical methods. Cyclic voltammetry was used to study reactions of Sn(II) and Sn(IV) species, x-ray photoelectron spectroscopy (XPS) was used to study surface chemistry, and chronopotentiometry was used to quantify equilibrium constants of Sn–carboxylic complexes. Reactions were investigated using carboxylic acid solutions such as adipic acid or maleic acid in polyethylene glycol. Carboxylic acid-based fluxes are practically inactive toward SnO
2
removal at room temperature (25°C); however, some species are capable of removing the oxides at temperatures as high as 180°C and at pH as low as 0.1. XPS results suggest the H
+
activity of the carboxylic acid is the key to removing SnO
2
on Sn-based solder surfaces. Equilibrium coefficients and potential-pH diagrams are given to elucidate the influence of pH on Sn surfaces. |
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AbstractList | New halide-free fluxes are becoming more prevalent in electronic packaging; however, their efficacy and reactive behavior with conventional solders has not been well characterized. In this work, we examine nonaqueous halide-free flux reactions of tin (Sn)-based solder surfaces using electrochemical methods. Cyclic voltammetry was used to study reactions of Sn(II) and Sn(IV) species, x-ray photoelectron spectroscopy (XPS) was used to study surface chemistry, and chronopotentiometry was used to quantify equilibrium constants of Sn-carboxylic complexes. Reactions were investigated using carboxylic acid solutions such as adipic acid or maleic acid in polyethylene glycol. Carboxylic acid-based fluxes are practically inactive toward SnO2 removal at room temperature (25°C); however, some species are capable of removing the oxides at temperatures as high as 180°C and at pH as low as 0.1. XPS results suggest the H^sup +^ activity of the carboxylic acid is the key to removing SnO2 on Sn-based solder surfaces. Equilibrium coefficients and potential-pH diagrams are given to elucidate the influence of pH on Sn surfaces. New halide-free fluxes are becoming more prevalent in electronic packaging; however, their efficacy and reactive behavior with conventional solders has not been well characterized. In this work, we examine nonaqueous halide-free flux reactions of tin (Sn)-based solder surfaces using electrochemical methods. Cyclic voltammetry was used to study reactions of Sn(II) and Sn(IV) species, x-ray photoelectron spectroscopy (XPS) was used to study surface chemistry, and chronopotentiometry was used to quantify equilibrium constants of Sn–carboxylic complexes. Reactions were investigated using carboxylic acid solutions such as adipic acid or maleic acid in polyethylene glycol. Carboxylic acid-based fluxes are practically inactive toward SnO 2 removal at room temperature (25°C); however, some species are capable of removing the oxides at temperatures as high as 180°C and at pH as low as 0.1. XPS results suggest the H + activity of the carboxylic acid is the key to removing SnO 2 on Sn-based solder surfaces. Equilibrium coefficients and potential-pH diagrams are given to elucidate the influence of pH on Sn surfaces. |
Author | Weinman, Craig J. Flake, John C. Ghosh, Tanushree Qu, Guoying |
Author_xml | – sequence: 1 givenname: Guoying surname: Qu fullname: Qu, Guoying organization: Cain Department of Chemical Engineering, Louisiana State University – sequence: 2 givenname: Craig J. surname: Weinman fullname: Weinman, Craig J. organization: Intel Corporation – sequence: 3 givenname: Tanushree surname: Ghosh fullname: Ghosh, Tanushree organization: Intel Corporation – sequence: 4 givenname: John C. surname: Flake fullname: Flake, John C. email: johnflake@lsu.edu organization: Cain Department of Chemical Engineering, Louisiana State University |
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References | JaroszJSinickiCComptes Rendus De L Academie Des Sciences Serie Ii1981292793 ZouLCXHuntCJ. Mater. Res.200823262210.1557/JMR.2008.0333 HanCFLiuQIveyDGElectrochim. Acta200853833210.1016/j.electacta.2008.06.037 MinoYJ. Health Sci.2006526710.1248/jhs.52.67 LangeNADeanJALange’s Handbook of Chemistry1973New YorkMcGraw-Hill TrandafirINourVIonicaMEPol J. Environ. Stud.201221749 YuSPLiaoCLHonMHWangMCJ Mater Sci200035421710.1023/A:1004867329163 QuGYVeguntaSSMaiKWeinmanCJGhoshTWuWFlakeJCJ. Electrochem. Soc.2013160E4910.1149/2.083304jes PangJHLLowTHXiongBSXuLHNeoCCThin Solid Films200446237010.1016/j.tsf.2004.05.092 BiegoGHBiaudetHJoyeuxMDebryGSci Des Aliments199616623 SerugaMMetikosHukovicMVallaTMilunMHoffschultzHWandeltKJ. Electroanal. Chem.19964078310.1016/0022-0728(95)04502-3 ZengKTuKNMater Sci Eng R-Rep2002385510.1016/S0927-796X(02)00007-4 PerringLBasic-DvorzakMAnal. Bioanal. Chem.200237423510.1007/s00216-002-1420-x VandeveldeBGonzalezMLimayePRatchevPBeyneEMicroelectron. Reliab.20074725910.1016/j.microrel.2006.09.034 CastellsCBRafolsCRosesMBoschEJ. Chromatogr. A200310024110.1016/S0021-9673(03)00644-7 StirrupBNHampsonNASurf Technol1977542910.1016/0376-4583(77)90011-5 PourbaixMAtlas of Electrochemical Equilibria in Aqueous Solutions1966OxfordPergamon Press WuYFTsaiTHMicroelectron. Eng.200784279010.1016/j.mee.2007.01.123 Abd El RehimSSHassanHHMohamedNFCorros. Sci.200446107110.1016/S0010-938X(03)00134-3 BardAJFaulknerLRElectrochemical Methods: Fundamentals and Applications1980New YorkWiley HoPSWangGTDingMZhaoJHDaiXMicroelectron. Reliab.20044471910.1016/j.microrel.2004.01.007 ZengKJStiermanRChiuTCEdwardsDAnoKTuKNJ Appl Phys20059702450810.1063/1.1839637 ChoHYunYHCeram. Int.20113761510.1016/j.ceramint.2010.09.033 SinglerTMeschterSSpalikJPuttlitzKStalterKHandbook of Lead-Free Solder Technology for Microelectronic Assemblies2004New YorkMarcel Dekker, Inc. TrandafirINourVIonicaMEJ Environ Prot Ecol20101149 YuSPLinHJHonMHWangMCJ. Mater Sci.200011461 YangWMesslerRWFeltonLEJ. Electron. Mater.19942376510.1007/BF02651371 G.C. Jasbir Bath, T. Jensen, R. Michalkiewicz, and B. Toleno, Paper presented at the IPC APEX Halogen-Free Packaging (Las Vegas, NV, 2011). TseleshASThin Solid Films2008516625310.1016/j.tsf.2007.11.118 BicharaLCBimbiMVFGervasiCAAlvarezPEBrandanSAJ. Mol. Struct.201210089510.1016/j.molstruc.2011.11.032 GH Biego (3635_CR24) 1996; 16 3635_CR11 LCX Zou (3635_CR7) 2008; 23 M Seruga (3635_CR20) 1996; 407 W Yang (3635_CR4) 1994; 23 SP Yu (3635_CR8) 2000; 35 M Pourbaix (3635_CR21) 1966 J Jarosz (3635_CR17) 1981; 292 YF Wu (3635_CR29) 2007; 84 SP Yu (3635_CR9) 2000; 11 Y Mino (3635_CR25) 2006; 52 AJ Bard (3635_CR18) 1980 I Trandafir (3635_CR27) 2010; 11 CB Castells (3635_CR30) 2003; 1002 B Vandevelde (3635_CR2) 2007; 47 L Perring (3635_CR26) 2002; 374 SS Abd El Rehim (3635_CR22) 2004; 46 AS Tselesh (3635_CR23) 2008; 516 BN Stirrup (3635_CR15) 1977; 5 PS Ho (3635_CR1) 2004; 44 KJ Zeng (3635_CR5) 2005; 97 I Trandafir (3635_CR28) 2012; 21 LC Bichara (3635_CR16) 2012; 1008 H Cho (3635_CR19) 2011; 37 GY Qu (3635_CR12) 2013; 160 CF Han (3635_CR14) 2008; 53 K Zeng (3635_CR3) 2002; 38 JHL Pang (3635_CR6) 2004; 462 NA Lange (3635_CR13) 1973 T Singler (3635_CR10) 2004 |
References_xml | – volume: 516 start-page: 6253 year: 2008 ident: 3635_CR23 publication-title: Thin Solid Films doi: 10.1016/j.tsf.2007.11.118 contributor: fullname: AS Tselesh – volume: 11 start-page: 49 year: 2010 ident: 3635_CR27 publication-title: J Environ Prot Ecol contributor: fullname: I Trandafir – volume: 97 start-page: 024508 year: 2005 ident: 3635_CR5 publication-title: J Appl Phys doi: 10.1063/1.1839637 contributor: fullname: KJ Zeng – volume: 23 start-page: 2622 year: 2008 ident: 3635_CR7 publication-title: J. Mater. Res. doi: 10.1557/JMR.2008.0333 contributor: fullname: LCX Zou – volume: 11 start-page: 461 year: 2000 ident: 3635_CR9 publication-title: J. Mater Sci. contributor: fullname: SP Yu – volume: 44 start-page: 719 year: 2004 ident: 3635_CR1 publication-title: Microelectron. Reliab. doi: 10.1016/j.microrel.2004.01.007 contributor: fullname: PS Ho – volume: 38 start-page: 55 year: 2002 ident: 3635_CR3 publication-title: Mater Sci Eng R-Rep doi: 10.1016/S0927-796X(02)00007-4 contributor: fullname: K Zeng – volume: 462 start-page: 370 year: 2004 ident: 3635_CR6 publication-title: Thin Solid Films doi: 10.1016/j.tsf.2004.05.092 contributor: fullname: JHL Pang – volume: 160 start-page: E49 year: 2013 ident: 3635_CR12 publication-title: J. Electrochem. Soc. doi: 10.1149/2.083304jes contributor: fullname: GY Qu – volume: 407 start-page: 83 year: 1996 ident: 3635_CR20 publication-title: J. Electroanal. Chem. doi: 10.1016/0022-0728(95)04502-3 contributor: fullname: M Seruga – volume: 21 start-page: 749 year: 2012 ident: 3635_CR28 publication-title: Pol J. Environ. Stud. contributor: fullname: I Trandafir – volume: 35 start-page: 4217 year: 2000 ident: 3635_CR8 publication-title: J Mater Sci doi: 10.1023/A:1004867329163 contributor: fullname: SP Yu – volume: 292 start-page: 793 year: 1981 ident: 3635_CR17 publication-title: Comptes Rendus De L Academie Des Sciences Serie Ii contributor: fullname: J Jarosz – volume: 53 start-page: 8332 year: 2008 ident: 3635_CR14 publication-title: Electrochim. Acta doi: 10.1016/j.electacta.2008.06.037 contributor: fullname: CF Han – volume: 47 start-page: 259 year: 2007 ident: 3635_CR2 publication-title: Microelectron. Reliab. doi: 10.1016/j.microrel.2006.09.034 contributor: fullname: B Vandevelde – volume: 46 start-page: 1071 year: 2004 ident: 3635_CR22 publication-title: Corros. Sci. doi: 10.1016/S0010-938X(03)00134-3 contributor: fullname: SS Abd El Rehim – volume: 1008 start-page: 95 year: 2012 ident: 3635_CR16 publication-title: J. Mol. Struct. doi: 10.1016/j.molstruc.2011.11.032 contributor: fullname: LC Bichara – volume: 1002 start-page: 41 year: 2003 ident: 3635_CR30 publication-title: J. Chromatogr. A doi: 10.1016/S0021-9673(03)00644-7 contributor: fullname: CB Castells – volume: 37 start-page: 615 year: 2011 ident: 3635_CR19 publication-title: Ceram. Int. doi: 10.1016/j.ceramint.2010.09.033 contributor: fullname: H Cho – volume-title: Lange’s Handbook of Chemistry year: 1973 ident: 3635_CR13 contributor: fullname: NA Lange – volume: 52 start-page: 67 year: 2006 ident: 3635_CR25 publication-title: J. Health Sci. doi: 10.1248/jhs.52.67 contributor: fullname: Y Mino – volume-title: Electrochemical Methods: Fundamentals and Applications year: 1980 ident: 3635_CR18 contributor: fullname: AJ Bard – volume-title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies year: 2004 ident: 3635_CR10 contributor: fullname: T Singler – volume-title: Atlas of Electrochemical Equilibria in Aqueous Solutions year: 1966 ident: 3635_CR21 contributor: fullname: M Pourbaix – volume: 5 start-page: 429 year: 1977 ident: 3635_CR15 publication-title: Surf Technol doi: 10.1016/0376-4583(77)90011-5 contributor: fullname: BN Stirrup – volume: 84 start-page: 2790 year: 2007 ident: 3635_CR29 publication-title: Microelectron. Eng. doi: 10.1016/j.mee.2007.01.123 contributor: fullname: YF Wu – volume: 23 start-page: 765 year: 1994 ident: 3635_CR4 publication-title: J. Electron. Mater. doi: 10.1007/BF02651371 contributor: fullname: W Yang – volume: 16 start-page: 623 year: 1996 ident: 3635_CR24 publication-title: Sci Des Aliments contributor: fullname: GH Biego – ident: 3635_CR11 – volume: 374 start-page: 235 year: 2002 ident: 3635_CR26 publication-title: Anal. Bioanal. Chem. doi: 10.1007/s00216-002-1420-x contributor: fullname: L Perring |
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SubjectTerms | Aqueous solutions Characterization and Evaluation of Materials Chemical reactions Chemistry and Materials Science Electronics and Microelectronics Equilibrium Instrumentation Materials Science Optical and Electronic Materials Soldering Solid State Physics |
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Title | Nonaqueous Halide-Free Flux Reactions with Tin-Based Solders |
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