Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

• Published in: Journal of alloys and compounds Vol. 860; p. 158553
• Main Authors: Soares, Thiago, Cruz, Clarissa, Xavier, Marcella, Reyes, Rodrigo V., Bertelli, Felipe, Garcia, Amauri, Spinelli, José E., Cheung, Noé
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 15.04.2021; Elsevier BV
• Subjects: Alloys; Antimony; Bi-Sb alloy; Bismuth; Copper; Corrosion resistance; Corrosion resistant alloys; Heat transfer; Heat transfer coefficients; Heat transmission; Interface; Interface reactions; Lead free; Microelectronics; Microstructure; Nickel; Peritectic alloys; Phase diagrams; Resistance; Solidification; Substrates; Wettability; Wetting; Microstructure; Bi-Sb alloy; Heat transfer; Interface; Solidification

•A Bi-Sb lead-free alloy has been solidified against three substrates: Cu, Ni and Steel.•A proposed thermal/experimental approach has analyzed solder/substrates interaction.•Experimental solidification thermal history gives supports to the approach.•The wettability has shown not be the main factor c...