Communication—Controlling Etching of Germanium through Surface Charge Manipulation
Potassium hydroxide (KOH) aqueous solutions can effectively etch germanium. Etch rates were determined in an electrolytic etch cell. Electrically isolated Ge wafers were subject to an etch rate of 1.45 ± 0.07 nm min −1 , increasing to 12.6 ± 0.2 nm min −1 when grounded, 97 ± 2 nm min −1 when biased...
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Published in | Journal of the Electrochemical Society Vol. 171; no. 2; pp. 23505 - 23507 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
United States
IOP Publishing
01.02.2024
The Electrochemical Society |
Subjects | |
Online Access | Get full text |
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