Asymptotic solutions for buckling delamination induced crack propagation in the thin film-compliant substrate system
In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the...
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| Published in | Theoretical and applied mechanics letters Vol. 4; no. 4; pp. 14 - 19 |
|---|---|
| Main Authors | , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier Ltd
2014
Elsevier |
| Subjects | |
| Online Access | Get full text |
| ISSN | 2095-0349 |
| DOI | 10.1063/2.1404103 |
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| Abstract | In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the interface crack at the ends may propagate. In the whole process, the compliance of the substrate compared with the film plays an important role. In this work, we study a circular film subject to compressive stress on an infinitely thick substrate. We study the effects of compliance of the substrate by modeling the system as a plate on an elastic foundation. The critical buckling condition is formulated. The asymptotic solutions of post-buckling deformation and the corresponding energy release rate of the interface crack are obtained with perturbation methods. The results show that the more compliant the substrate is, the easier for the film to buckle and easier for the interface crack to propagate after buckling. |
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| AbstractList | In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the interface crack at the ends may propagate. In the whole process, the compliance of the substrate compared with the film plays an important role. In this work, we study a circular film subject to compressive stress on an infinitely thick substrate. We study the effects of compliance of the substrate by modeling the system as a plate on an elastic foundation. The critical buckling condition is formulated. The asymptotic solutions of post-buckling deformation and the corresponding energy release rate of the interface crack are obtained with perturbation methods. The results show that the more compliant the substrate is, the easier for the film to buckle and easier for the interface crack to propagate after buckling. |
| ArticleNumber | 041003 |
| Author | Tongqing Lu Tiejun Wang |
| AuthorAffiliation | State Key Lab for Strength and Vibration of Mechanical Structures,School of Aerospace Engineering, Xi＇an Jiaotong University, Xi＇an 710049, China |
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| Cites_doi | 10.1023/A:1007628800620 10.1115/1.1988347 10.1126/science.1068609 10.1023/A:1013790232359 10.1016/0020-7683(84)90012-X 10.1016/j.surfcoat.2012.06.074 10.1016/S1359-6454(98)00172-4 10.1016/j.ijengsci.2011.05.009 10.7498/aps.10.209 10.1016/S0065-2156(08)70164-9 10.1016/S1359-6454(01)00423-2 10.1016/j.apsusc.2012.06.036 10.1016/S0079-6425(00)00020-7 |
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| Keywords | post-buckling film-substrate system interface crack buckling delamination |
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| Notes | In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the interface crack at the ends may propagate. In the whole process, the compliance of the substrate compared with the film plays an important role. In this work, we study a circular film subject to compressive stress on an infinitely thick substrate. We study the effects of compliance of the substrate by modeling the system as a plate on an elastic foundation. The critical buckling condition is formulated. The asymptotic solutions of post-buckling deformation and the corresponding energy release rate of the interface crack are obtained with perturbation methods. The results show that the more compliant the substrate is, the easier for the film to buckle and easier for the interface crack to propagate after buckling. buckling delamination, interface crack, film-substrate system, post-buckling 11-5991/O3 |
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| References_xml | – volume: 104 start-page: 169 year: 2000 end-page: 179 ident: bib0055 article-title: Buckling and cracking of thin film on compliant substrates under compression publication-title: International Journal of Fracture – volume: 10 start-page: 209 year: 1954 end-page: 238 ident: bib0075 article-title: On the large deflection of circular plate publication-title: Acta Physica Sinica – volume: 113 start-page: 39 year: 2002 end-page: 55 ident: bib0060 article-title: Influence of substrate compliance on buckling delamination of thin films publication-title: International Journal of Fracture – volume: 20 start-page: 455 year: 1984 end-page: 466 ident: bib0035 article-title: On the mechanics of delamination and spalling in compressed films publication-title: International Journal of Solids and Structures – volume: 296 year: 2002 ident: bib0005 article-title: Thermal barrier coatings for gas-turbine engine applications publication-title: Science – volume: 49 start-page: 967 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| SubjectTerms | buckling delamination film-substrate system interface crack post-buckling 兼容 基板 屈曲变形 模拟系统 渐近解 界面裂纹 薄膜 裂纹扩展 |
| Title | Asymptotic solutions for buckling delamination induced crack propagation in the thin film-compliant substrate system |
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