Process optimization for inkjet printing of triisopropylsilylethynyl pentacene with single-solvent solutions

Inkjet printing of 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-PEN), a small molecule organic semiconductor, is performed on two types of substrates. Hydrophilic SiO2 substrates prepared by a combination of surface treatments lead to either a smaller size or a coffee-ring profile of the singl...

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Published inThin solid films Vol. 578; pp. 11 - 19
Main Authors Wang, Xianghua, Yuan, Miao, Xiong, Xianfeng, Chen, Mengjie, Qin, Mengzhi, Qiu, Longzhen, Lu, Hongbo, Zhang, Guobing, Lv, Guoqiang, Choi, Anthony H.W.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 02.03.2015
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Summary:Inkjet printing of 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-PEN), a small molecule organic semiconductor, is performed on two types of substrates. Hydrophilic SiO2 substrates prepared by a combination of surface treatments lead to either a smaller size or a coffee-ring profile of the single-drop film. A hydrophobic surface with dominant dispersive component of surface energy such as that of a spin-coated poly(4-vinylphenol) film favors profile formation with uniform thickness of the printed semiconductor owing to the strong dispersion force between the semiconductor molecules and the hydrophobic surface of the substrate. With a hydrophobic dielectric as the substrate and via a properly selected solvent, high quality TIPS-PEN films were printed at a very low substrate temperature of 35°C. Saturated field-effect mobility measured with top-contact thin-film transistor structure shows a narrow distribution and a maximum of 0.78cm2V−1s−1, which confirmed the film growth on the hydrophobic substrate with increased crystal coverage and continuity under the optimized process condition. •Hydrophobic substrates were employed to inhibit the coffee-ring effect.•Contact-line pinning is primarily controlled by the dispersion force.•Solvent selection is critical to crystal coverage of the printed film.•High performance and uniformity are achieved by process optimization.
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content type line 23
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2015.02.004