Enhancement and Prediction of Adhesion Strength of Copper Cold Spray Coatings on Steel Substrates for Nuclear Fuel Repository

• Published in: Journal of thermal spray technology Vol. 25; no. 8; pp. 1577 - 1587
• Main Authors: Fernández, R., MacDonald, D., Nastić, A., Jodoin, B., Tieu, A., Vijay, M.
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.12.2016
• Subjects: Analytical Chemistry; Characterization and Evaluation of Materials; Chemistry and Materials Science; Corrosion and Coatings; Machines; Manufacturing; Materials Science; Peer Reviewed; Processes; Surfaces and Interfaces; Thin Films; Tribology; FEA; cold spray; mechanical anchoring; substrate preparation; nuclear waste management; adhesion; forced pulsed waterjet
• ISSN: 1059-9630; 1544-1016
• DOI: 10.1007/s11666-016-0467-8

Thick copper coatings have been envisioned as corrosion protection barriers for steel containers used in repositories for nuclear waste fuel bundles. Due to its high deposition rate and low oxidation levels, cold spray is considered as an option to produce these coatings as an alternative to traditional machining processes to create corrosion protective sleeves. Previous investigations on the deposition of thick cold spray copper coatings using only nitrogen as process gas on carbon steel substrates have continuously resulted in coating delamination. The current work demonstrates the possibility of using an innovative surface preparation process, forced pulsed waterjet, to induce a complex substrate surface morphology that serves as anchoring points for the copper particles to mechanically adhere to the substrate. The results of this work show that, through the use of this surface preparation method, adhesion strength can be drastically increased, and thick copper coatings can be deposited using nitrogen. Through finite element analysis, it was shown that it is likely that the bonding created is purely mechanical, explaining the lack of adhesion when conventional substrate preparation methods are used and why helium is usually required as process gas.