Application of Micromachined Y -Cut-Quartz Bulk Acoustic Wave Resonator for Infrared Sensing

This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y-cut-quartz bulk acoustic wave resonators. A novel method of tracking the resonance frequency based upon the measurement of impedance is present...

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Published inJournal of microelectromechanical systems Vol. 20; no. 1; pp. 288 - 296
Main Authors Pisani, M B, Kailiang Ren, Ping Kao, Tadigadapa, Srinivas
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.02.2011
Institute of Electrical and Electronics Engineers
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Abstract This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y-cut-quartz bulk acoustic wave resonators. A novel method of tracking the resonance frequency based upon the measurement of impedance is presented. High-frequency (240-MHz) micromachined resonators from Y-cut-quartz crystal cuts were fabricated using heterogeneous integration techniques on a silicon wafer. A temperature sensitivity of 22.16 kHz/°C was experimentally measured. IR measurements on the resonator pixel resulted in a noise equivalent power of 3.90 nW/Hz 1/2 , a detectivity D* of 1 × 10 5 cm · Hz 1/2 /W, and a noise equivalent temperature difference of 4 mK in the 8- to 14-μm wavelength range. The thermal frequency response of the resonator was determined to be faster than 33 Hz, demonstrating its applicability in video-rate uncooled IR imaging. This work represents the first comprehensive thermal characterization of micromachined F-cut-quartz resonators and their IR sensing response.
AbstractList This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y -cut-quartz bulk acoustic wave resonators. A novel method of tracking the resonance frequency based upon the measurement of impedance is presented. High-frequency (240-MHz) micromachined resonators from Y -cut-quartz crystal cuts were fabricated using heterogeneous integration techniques on a silicon wafer. A temperature sensitivity of 22.16 hbox kHz / [compfn] hbox C was experimentally measured. IR measurements on the resonator pixel resulted in a noise equivalent power of 3.90 hbox nW / Hz 1 / 2 , a detectivity D ast of 1 10 5 Unknown character hbox cm times hbox Hz 1 / 2 / hbox W , and a noise equivalent temperature difference of 4 mK in the 8- to 14- mu hbox m wavelength range. The thermal frequency response of the resonator was determined to be faster than 33 Hz, demonstrating its applicability in video-rate uncooled IR imaging. This work represents the first comprehensive thermal characterization of micromachined Y -cut-quartz resonators and their IR sensing response. hfill 2010-0217
This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y-cut-quartz bulk acoustic wave resonators. A novel method of tracking the resonance frequency based upon the measurement of impedance is presented. High-frequency (240-MHz) micromachined resonators from Y-cut-quartz crystal cuts were fabricated using heterogeneous integration techniques on a silicon wafer. A temperature sensitivity of 22.16 kHz/°C was experimentally measured. IR measurements on the resonator pixel resulted in a noise equivalent power of 3.90 nW/Hz 1/2 , a detectivity D* of 1 × 10 5 cm · Hz 1/2 /W, and a noise equivalent temperature difference of 4 mK in the 8- to 14-μm wavelength range. The thermal frequency response of the resonator was determined to be faster than 33 Hz, demonstrating its applicability in video-rate uncooled IR imaging. This work represents the first comprehensive thermal characterization of micromachined F-cut-quartz resonators and their IR sensing response.
Author Pisani, M B
Kailiang Ren
Tadigadapa, Srinivas
Ping Kao
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Cites_doi 10.1109/ULTSYM.1985.198533
10.1016/S0079-6727(02)00024-1
10.1109/58.393101
10.1088/0034-4885/64/10/203
10.1016/S0924-4247(97)01697-X
10.1109/84.506201
10.1109/T-UFFC.1987.26997
10.1109/58.20453
10.1029/RS014i004p00521
10.1016/j.sna.2008.11.013
10.1109/JMEMS.2009.2015498
10.1117/12.542482
10.1109/FREQ.1996.559931
10.1117/12.783853
10.1117/12.160553
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Issue 1
Keywords Infrared thermography
Bulk acoustic wave resonator
Tracking
Micromachining
Bulk wave
Y-cut quartz
Frequency measurement
Quartz
infrared (IR) detector
Quartz resonator
quartz micromachining
Resonance frequency
thermal IR sensor
Silicon
Thermal imaging
High frequency
Microelectromechanical device
Pixel
Room temperature
heterogeneous microelectromechanical systems integration
Production process
Language English
License CC BY 4.0
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Institute of Electrical and Electronics Engineers
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References lesage (ref19) 1979; 14
ref12
ref15
wood (ref2) 1993
ref14
ref11
ref10
van-der-ziel (ref18) 1976
li (ref6) 2007
niklaus (ref4) 2007
ref17
ref16
ref8
ref7
ref9
ref3
ref5
kao (ref13) 2009; 149
tadigadapa (ref1) 2006
References_xml – ident: ref9
  doi: 10.1109/ULTSYM.1985.198533
– ident: ref3
  doi: 10.1016/S0079-6727(02)00024-1
– year: 2006
  ident: ref1
  publication-title: Encyclopedia of Sensors
  contributor:
    fullname: tadigadapa
– ident: ref17
  doi: 10.1109/58.393101
– ident: ref7
  doi: 10.1088/0034-4885/64/10/203
– ident: ref12
  doi: 10.1016/S0924-4247(97)01697-X
– start-page: 65421y-12
  year: 2007
  ident: ref6
  article-title: Recent development of ultra small pixel uncooled focal plane arrays at DRS
  publication-title: Proc SPIEInfrared Technology and Applications XXXIII
  contributor:
    fullname: li
– ident: ref10
  doi: 10.1109/84.506201
– ident: ref16
  doi: 10.1109/T-UFFC.1987.26997
– ident: ref14
  doi: 10.1109/58.20453
– volume: 14
  start-page: 521
  year: 1979
  ident: ref19
  article-title: characterization and measurement of time and frequency stability
  publication-title: Radio Sci
  doi: 10.1029/RS014i004p00521
  contributor:
    fullname: lesage
– year: 1976
  ident: ref18
  publication-title: Noise in Measurements
  contributor:
    fullname: van-der-ziel
– start-page: 68360d-15
  year: 2007
  ident: ref4
  article-title: MEMS-based uncooled infrared bolometer arrays: A review
  publication-title: Proc SPIEMEMS/MOEMS Technologies and Applications III
  contributor:
    fullname: niklaus
– volume: 149
  start-page: 189
  year: 2009
  ident: ref13
  article-title: micromachined quartz resonator based infrared detector array
  publication-title: Sens Actuators A Phys
  doi: 10.1016/j.sna.2008.11.013
  contributor:
    fullname: kao
– ident: ref15
  doi: 10.1109/JMEMS.2009.2015498
– ident: ref5
  doi: 10.1117/12.542482
– ident: ref11
  doi: 10.1109/FREQ.1996.559931
– ident: ref8
  doi: 10.1117/12.783853
– start-page: 322
  year: 1993
  ident: ref2
  publication-title: Infrared Technology XIX
  doi: 10.1117/12.160553
  contributor:
    fullname: wood
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Snippet This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on...
This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y...
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SubjectTerms Acoustics
Applied sciences
Bulk acoustic wave resonator
Detection
Detectors
Electronics
Exact sciences and technology
heterogeneous microelectromechanical systems integration
Imaging
Impedance
infrared (IR) detector
Infrared radiation
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromachining
Micromechanical devices and systems
Micromechanics
Noise
Noise equivalent temperature difference
Optical resonators
Physics
Precision engineering, watch making
quartz micromachining
Resonant frequency
Resonators
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature measurement
Temperature sensors
thermal IR sensor
Y -cut quartz
Title Application of Micromachined Y -Cut-Quartz Bulk Acoustic Wave Resonator for Infrared Sensing
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