Electromagnetic-Thermal-Flow Field Coupling Simulation of 12-kV Medium-Voltage Switchgear

Long-term heating and excessive temperature rise will significantly affect the electrical and insulation performance of electric power equipment, causing the potential security risk. In this paper, the temperature rise situation under normal operation of a 12-kV medium voltage switchgear is studied...

Full description

Saved in:
Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 6; no. 8; pp. 1208 - 1220
Main Authors Wang, Lijun, Zheng, Wensong, Wang, Liuhuo, Lin, Jing, Li, Xiaolin, Jia, Shenli
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.08.2016
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Long-term heating and excessive temperature rise will significantly affect the electrical and insulation performance of electric power equipment, causing the potential security risk. In this paper, the temperature rise situation under normal operation of a 12-kV medium voltage switchgear is studied through modeling and simulation method. First, in the simulation analysis of the whole switchgear, based on the theory of eddy-current field, gas flow field, and temperature field, the temperature rise distribution of the switchgear under the condition of natural convection and forced convection is simulated and analyzed. Then, several improvement methods are taken to reduce the temperature rise that emerges in the switchgear, including using spring contact finger structure to replace flexible connection structure, and also the optimization scheme of vacuum circuit breaker (VCB) pole and current transformer (CT). Then, simulation and research of different improvement schemes are conducted based on the electromagnetic-thermal-flow field coupling method. The simulation results of whole switchgear show that the above coupling method is very useful for the calculation of temperature rise. The simulation results also show that the spring contact structure is beneficial to reduce the temperature rise of vacuum interrupter and mechanical connection part. After the modification of design, the temperature rise conditions of the VCB pole and CT are significantly improved.
AbstractList Long-term heating and excessive temperature rise will significantly affect the electrical and insulation performance of electric power equipment, causing the potential security risk. In this paper, the temperature rise situation under normal operation of a 12-kV medium voltage switchgear is studied through modeling and simulation method. First, in the simulation analysis of the whole switchgear, based on the theory of eddy-current field, gas flow field, and temperature field, the temperature rise distribution of the switchgear under the condition of natural convection and forced convection is simulated and analyzed. Then, several improvement methods are taken to reduce the temperature rise that emerges in the switchgear, including using spring contact finger structure to replace flexible connection structure, and also the optimization scheme of vacuum circuit breaker (VCB) pole and current transformer (CT). Then, simulation and research of different improvement schemes are conducted based on the electromagnetic-thermal-flow field coupling method. The simulation results of whole switchgear show that the above coupling method is very useful for the calculation of temperature rise. The simulation results also show that the spring contact structure is beneficial to reduce the temperature rise of vacuum interrupter and mechanical connection part. After the modification of design, the temperature rise conditions of the VCB pole and CT are significantly improved.
Author Xiaolin Li
Lijun Wang
Wensong Zheng
Jing Lin
Liuhuo Wang
Shenli Jia
Author_xml – sequence: 1
  givenname: Lijun
  surname: Wang
  fullname: Wang, Lijun
– sequence: 2
  givenname: Wensong
  surname: Zheng
  fullname: Zheng, Wensong
– sequence: 3
  givenname: Liuhuo
  surname: Wang
  fullname: Wang, Liuhuo
– sequence: 4
  givenname: Jing
  surname: Lin
  fullname: Lin, Jing
– sequence: 5
  givenname: Xiaolin
  surname: Li
  fullname: Li, Xiaolin
– sequence: 6
  givenname: Shenli
  surname: Jia
  fullname: Jia, Shenli
BookMark eNpdkE1PwkAQhjcGExH5A3pp4sVLcXfLfvRoCKgJRBOQxFOz3U5hcdvFbRviv7cVwsG5zByed_LmuUa90pWA0C3BI0Jw_LiavC9WI4oJH1EmOcfkAvUpYTyMYsl655vhKzSsqh1uh0kscNRHn1MLuvauUJsSaqPD1RZ8oWw4s-4QzAzYLJi4Zm9NuQmWpmisqo0rA5cHhIZf62ABmWmKcO1srTYQLA-m1tsNKH-DLnNlKxie9gB9zKaryUs4f3t-nTzNQx1RWYdxxlMhlaJd10zwXKd5lvExVRhyHQnQEEsl0giyTPGU4TzOmVRjCpjpWMlogB6Of_fefTdQ1UlhKg3WqhJcUyVERowzLFmH3v9Dd67xZduupQhmgjEpWooeKe1dVXnIk703hfI_CcFJJzz5E550wpOT8DZ0dwwZADgHBKMUCxH9Av2Nfmc
CODEN ITCPC8
CitedBy_id crossref_primary_10_1049_tje2_12166
crossref_primary_10_1016_j_ijepes_2023_109129
crossref_primary_10_1109_ACCESS_2019_2903889
crossref_primary_10_1016_j_applthermaleng_2017_10_066
crossref_primary_10_1109_TCPMT_2019_2937839
crossref_primary_10_1016_j_epsr_2022_109081
crossref_primary_10_54097_hset_v77i_14364
crossref_primary_10_1016_j_applthermaleng_2019_114076
crossref_primary_10_1049_hve_2019_0280
crossref_primary_10_1109_ACCESS_2019_2938313
crossref_primary_10_1109_ACCESS_2019_2908993
crossref_primary_10_1109_TCPMT_2017_2767570
crossref_primary_10_1088_1742_6596_2179_1_012010
crossref_primary_10_1016_j_compscitech_2020_108199
crossref_primary_10_1016_j_tsep_2023_101954
crossref_primary_10_1515_ijeeps_2018_0068
crossref_primary_10_1016_j_csite_2021_101479
Cites_doi 10.1109/TMAG.1983.1062819
10.1109/TCAPT.2007.906288
10.1109/TCPMT.2015.2396197
10.1109/TCAPT.2002.804608
ContentType Journal Article
Copyright Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2016
Copyright_xml – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2016
DBID 97E
RIA
RIE
AAYXX
CITATION
7SP
8FD
F28
FR3
L7M
DOI 10.1109/TCPMT.2016.2586601
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998-Present
IEEE Electronic Library Online
CrossRef
Electronics & Communications Abstracts
Technology Research Database
ANTE: Abstracts in New Technology & Engineering
Engineering Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Engineering Research Database
Technology Research Database
Advanced Technologies Database with Aerospace
ANTE: Abstracts in New Technology & Engineering
Electronics & Communications Abstracts
DatabaseTitleList
Engineering Research Database
Engineering Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2156-3985
EndPage 1220
ExternalDocumentID 4143865321
10_1109_TCPMT_2016_2586601
7522077
Genre orig-research
GrantInformation_xml – fundername: Natural Science Basic Research plan in Shaanxi Province of China
  grantid: 2016JM5051
– fundername: National Key Basic Research Program of China (973 Program)
  grantid: 2015CB251002
GroupedDBID 0R~
4.4
6IK
97E
AAJGR
AASAJ
ABQJQ
ABVLG
ACIWK
AENEX
AKJIK
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
EJD
IFIPE
IPLJI
JAVBF
M43
OCL
RIA
RIE
RIG
RNS
AAYXX
CITATION
7SP
8FD
F28
FR3
L7M
ID FETCH-LOGICAL-c328t-9d6b78aa23985d76fcbfdd642a0efc37ece98a7b3edda6b50f9f58a42e05c9a83
IEDL.DBID RIE
ISSN 2156-3950
IngestDate Fri Aug 16 12:15:15 EDT 2024
Fri Sep 13 06:43:40 EDT 2024
Fri Aug 23 00:53:26 EDT 2024
Wed Jun 26 19:22:19 EDT 2024
IsPeerReviewed true
IsScholarly true
Issue 8
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c328t-9d6b78aa23985d76fcbfdd642a0efc37ece98a7b3edda6b50f9f58a42e05c9a83
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
PQID 1810575587
PQPubID 1006342
PageCount 13
ParticipantIDs proquest_miscellaneous_1835650858
proquest_journals_1810575587
ieee_primary_7522077
crossref_primary_10_1109_TCPMT_2016_2586601
PublicationCentury 2000
PublicationDate 2016-Aug.
2016-8-00
20160801
PublicationDateYYYYMMDD 2016-08-01
PublicationDate_xml – month: 08
  year: 2016
  text: 2016-Aug.
PublicationDecade 2010
PublicationPlace Piscataway
PublicationPlace_xml – name: Piscataway
PublicationTitle IEEE transactions on components, packaging, and manufacturing technology (2011)
PublicationTitleAbbrev TCPMT
PublicationYear 2016
Publisher IEEE
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
References ref9
ref3
(ref8) 2012
singh (ref6) 2011
frei (ref11) 2006
ref2
wu (ref5) 2002; 21
ref1
liu (ref4) 2003; 18
(ref10) 2012
kaltenborn (ref7) 2011
References_xml – start-page: 577
  year: 2006
  ident: ref11
  article-title: Simulation of electrical field and breakdown phenomena in low voltage circuit breakers
  publication-title: Proc 23rd Int Conf Electr Contacts
  contributor:
    fullname: frei
– ident: ref9
  doi: 10.1109/TMAG.1983.1062819
– start-page: 492
  year: 2011
  ident: ref7
  article-title: Dynamic thermal simulation of gas insulated switchgear
  publication-title: Proc 21st Int Conf Exh Electr Distrib
  contributor:
    fullname: kaltenborn
– ident: ref2
  doi: 10.1109/TCAPT.2007.906288
– volume: 21
  start-page: 62
  year: 2002
  ident: ref5
  article-title: Analysis of thermal capacity for busbar trunking system by coupled magneto-fluid-thermal field calculation
  publication-title: Adv Technol Elect Eng Energy
  contributor:
    fullname: wu
– year: 2012
  ident: ref10
  publication-title: Ansys Fluent 15 0 Help Document
– year: 2012
  ident: ref8
  publication-title: Ansys Maxwell 16 0 Help Document
– volume: 18
  start-page: 59
  year: 2003
  ident: ref4
  article-title: Design and analysis of new type air-core reactor based on coupled fluid-thermal field calculation
  publication-title: Trans China Electrotech Soc
  contributor:
    fullname: liu
– ident: ref3
  doi: 10.1109/TCPMT.2015.2396197
– start-page: 495
  year: 2011
  ident: ref6
  article-title: A novel approach for the thermal analysis of air insulated switchgear
  publication-title: Proc 21st Int Conf Exh Electr Distrib
  contributor:
    fullname: singh
– ident: ref1
  doi: 10.1109/TCAPT.2002.804608
SSID ssj0000580703
Score 2.2076252
Snippet Long-term heating and excessive temperature rise will significantly affect the electrical and insulation performance of electric power equipment, causing the...
SourceID proquest
crossref
ieee
SourceType Aggregation Database
Publisher
StartPage 1208
SubjectTerms Computer simulation
Contact
Contacts
Coupling
Couplings
Eddy-current field
Electric potential
Electromagnetics
gas flow field
Magnetic domains
Mathematical models
medium-voltage switchgear
Poles
Repair & maintenance
Simulation
Switchgear
Temperature distribution
temperature rise
Thermal conductivity
Title Electromagnetic-Thermal-Flow Field Coupling Simulation of 12-kV Medium-Voltage Switchgear
URI https://ieeexplore.ieee.org/document/7522077
https://www.proquest.com/docview/1810575587/abstract/
https://search.proquest.com/docview/1835650858
Volume 6
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1bS8MwFD44n_TBuzhvRPBNs2Xt0iaPMiwiTASnzKeSNukY21rRloG_3pxehqgPvhUS0pBzkvMl5_IBXCKHsWdRGzUyxqLaSlChepxaY9FT1uIqtyxWPXzw7p7792M-XoPrVS6MMaYMPjMd_Cx9-TqLC3wq6_oWLDDfb0FLMKfK1Vq9pzAuUHuRS85eSagrOWtyZJjsjgaPwxEGcnkdhwvPqzlgGjtUEqv8Oo1LExNsw7CZXBVZMusUedSJP3_Ubfzv7Hdgq8aa5KZSjl1YM-kebH6rQLgPr7cVDc5CTVJMZ6RWbexRPafBPFuSAMPbyCArMG13Qp6mi5rsi2QJ6Tl09kLQ0VMs6Es2z-3JRJ6WU6sGE7t9DuA5uB0N7mjNtkBj1xE5ldqLfKEUFgTk2veSOEq0ttcTxUwSu76JjRTKj1yjtfIizhKZcKH6jmE8lkq4h7CeZqk5AsKkz5xIREJjKqs2ItHc5RYIaeEkTMs2XDVrH75VRTXC8jLCZFhKKkRJhbWk2rCPi7nqWa9jG04bcYX1vvsILV5BAMqFbb5YNdsdg24QlZqswD4uR1zKxfHfI5_ABv6_CvM7hfX8vTBnFnrk0Xmpc1-_EtS0
link.rule.ids 315,786,790,802,27957,27958,55109
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT-MwEB4Be1g47IOH6MKCV-K2uLgJTuwjqqjKowiJguAUObFTIdoEQSIkfj0zeVRo2QO3SLaikWfs-caemQ9gjziMA0Rt3OmEmmobxZXpSY7OomfQ4xq_alY9ugiG14ent_J2AfbntTDOuSr5zHXps3rLt3lS0lXZQYhgQYThInxBPy90Xa01v1ERUpH9EpscBiXc11K0VTJCH4z7l6MxpXIFXU-qIGhYYFpPVFGrfDiPKycz-A6jVrw6t-ShWxZxN3n9p3PjZ-X_Ad8atMmOavP4CQsuW4WVdz0I1-DuuCbCmZlJRgWNHA0HD-spH0zzFzagBDfWz0sq3J2wq_tZQ_fF8pT1PP5ww-ipp5zxm3xa4NnErl7u0RAmuIHW4XpwPO4PecO3wBPfUwXXNohDZQy1BJQ2DNIkTq3FAMUIlyZ-6BKnlQlj31lrgliKVKdSmUPPCZloo_wNWMryzG0CEzoUXqxiZamY1TqVWulLhEJWeamwugN_27WPHuu2GlEVjggdVZqKSFNRo6kOrNFizmc269iB7VZdUbPzniNELARBpcLhP_Nh3DP0EGIyl5c0x5eETKX69f8_78LX4Xh0Hp2fXJxtwTLJUif9bcNS8VS63whEininsr83IPvYCg
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Electromagnetic-Thermal-Flow+Field+Coupling+Simulation+of+12-kV+Medium-Voltage+Switchgear&rft.jtitle=IEEE+transactions+on+components%2C+packaging%2C+and+manufacturing+technology+%282011%29&rft.au=Wang%2C+Lijun&rft.au=Zheng%2C+Wensong&rft.au=Wang%2C+Liuhuo&rft.au=Lin%2C+Jing&rft.date=2016-08-01&rft.issn=2156-3950&rft.eissn=2156-3985&rft.volume=6&rft.issue=8&rft.spage=1208&rft.epage=1220&rft_id=info:doi/10.1109%2FTCPMT.2016.2586601&rft.externalDBID=NO_FULL_TEXT
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2156-3950&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2156-3950&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2156-3950&client=summon