Moisture sensor at glass/polymer interface for monitoring of photovoltaic module encapsulants

A sensor developed for measurement of water concentration inside glass/polymer encapsulation structures with a particular application area in accelerated aging of photovoltaic module encapsulants is described. An approximately 5 μm thick porous TiO 2 film applied to a glass substrate with a conducti...

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Published inSensors and actuators. A. Physical. Vol. 125; no. 2; pp. 281 - 287
Main Authors Carlsson, Thomas, Halme, Janne, Lund, Peter, Konttinen, Petri
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.01.2006
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Abstract A sensor developed for measurement of water concentration inside glass/polymer encapsulation structures with a particular application area in accelerated aging of photovoltaic module encapsulants is described. An approximately 5 μm thick porous TiO 2 film applied to a glass substrate with a conductive coating acts as the moisture-sensitive component. The response is calibrated with weather chamber experiments for sensors open to the environment and with diffusion experiments for sensors laminated under an encapsulant. For the interpretation of diffusion experiment results, a transport model describing the diffusion of water across the polymer/TiO 2 interface is developed. The logarithm of AC resistance shows a linear dependence on water concentration in both open and encapsulated calibration. The first measurable response from an encapsulated 3.5 mm × 8 mm size sensor is obtained when approximately 10 μg of water has entered the film. Implications of the calibration results for sensor usage in accelerated aging tests are discussed.
AbstractList A sensor developed for measurement of water concentration inside glass/polymer encapsulation structures with a particular application area in accelerated aging of photovoltaic module encapsulants is described. An approximately 5mum thick porous TiO2 film applied to a glass substrate with a conductive coating acts as the moisture-sensitive component. The response is calibrated with weather chamber experiments for sensors open to the environment and with diffusion experiments for sensors laminated under an encapsulant. For the interpretation of diffusion experiment results, a transport model describing the diffusion of water across the polymer/TiO2 interface is developed. The logarithm of AC resistance shows a linear dependence on water concentration in both open and encapsulated calibration. The first measurable response from an encapsulated 3.5mmX8mm size sensor is obtained when approximately 10mug of water has entered the film. Implications of the calibration results for sensor usage in accelerated aging tests are discussed.
A sensor developed for measurement of water concentration inside glass/polymer encapsulation structures with a particular application area in accelerated aging of photovoltaic module encapsulants is described. An approximately 5 μm thick porous TiO 2 film applied to a glass substrate with a conductive coating acts as the moisture-sensitive component. The response is calibrated with weather chamber experiments for sensors open to the environment and with diffusion experiments for sensors laminated under an encapsulant. For the interpretation of diffusion experiment results, a transport model describing the diffusion of water across the polymer/TiO 2 interface is developed. The logarithm of AC resistance shows a linear dependence on water concentration in both open and encapsulated calibration. The first measurable response from an encapsulated 3.5 mm × 8 mm size sensor is obtained when approximately 10 μg of water has entered the film. Implications of the calibration results for sensor usage in accelerated aging tests are discussed.
Author Konttinen, Petri
Carlsson, Thomas
Halme, Janne
Lund, Peter
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Issue 2
Keywords Encapsulation
EVA
Thin-film
PV
Moisture sensor
CPE
Titanium dioxide
Photovoltaics
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SubjectTerms Encapsulation
Moisture sensor
Photovoltaics
Thin-film
Titanium dioxide
Title Moisture sensor at glass/polymer interface for monitoring of photovoltaic module encapsulants
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