Ultrasonic delamination based adhesion testing for high-throughput assembly of van der Waals heterostructures

• Published in: Journal of applied physics Vol. 132; no. 22
• Main Authors: Peña, Tara, Holt, Jewel, Sewaket, Arfan, Wu, Stephen M.
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 14.12.2022
• Subjects: Adhesion tests; Applied physics; Assembly; Bilayers; Delamination; Electrical properties; Graphene; Heterostructures; High temperature; Microscopy; Optical properties; Polymers; Process parameters; Silicon dioxide; Silicon substrates; Two dimensional materials; Ultrasonic testing

Two-dimensional (2D) materials assembled into van der Waals (vdW) heterostructures contain unlimited combinations of mechanical, optical, and electrical properties that can be harnessed for potential device applications. Critically, these structures require control over interfacial adhesion for enab...