Ultrasonic delamination based adhesion testing for high-throughput assembly of van der Waals heterostructures - Peña, Tara; Holt, Jewel; Sewaket, Arfan; Wu, Stephen M. (Journal of applied physics, 2022)
Keywords: Adhesion tests; Applied physics; Assembly; Bilayers; Delamination; Electrical properties; Graphene; Heterostructures; High temperature; Microscopy; Optical properties; Polymers; Process parameters; Silicon dioxide; Silicon substrates; Two dimensional materials; Ultrasonic testing