APA (7th ed.) Citation

Peña, T., Holt, J., Sewaket, A., & Wu, S. M. (2022). Ultrasonic delamination based adhesion testing for high-throughput assembly of van der Waals heterostructures. Journal of applied physics, 132(22), . https://doi.org/10.1063/5.0126446

Chicago Style (17th ed.) Citation

Peña, Tara, Jewel Holt, Arfan Sewaket, and Stephen M. Wu. "Ultrasonic Delamination Based Adhesion Testing for High-throughput Assembly of Van Der Waals Heterostructures." Journal of Applied Physics 132, no. 22 (2022). https://doi.org/10.1063/5.0126446.

MLA (9th ed.) Citation

Peña, Tara, et al. "Ultrasonic Delamination Based Adhesion Testing for High-throughput Assembly of Van Der Waals Heterostructures." Journal of Applied Physics, vol. 132, no. 22, 2022, https://doi.org/10.1063/5.0126446.