Health Monitoring and Prognostics of Electronics Subject to Vibration Load Conditions

• Published in: IEEE sensors journal Vol. 9; no. 11; pp. 1479 - 1485
• Main Authors: Jie Gu, Barker, D., Pecht, M.
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.11.2009; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Accelerometer; Accelerometers; Capacitive sensors; Circuit boards; Condition monitoring; Consumption; Electrical resistance measurement; Electronic components; Electronics; Estimates; Fatigue; Fatigue failure; health monitoring; Integrated circuit interconnections; Life estimation; Mathematical models; Monitors; printed circuit board; Printed circuits; prognostics; reliability; strain gauge; Stress; Vibration

This paper discusses a health monitoring and prognostics methodology for assessing the reliability of a group of electronic components mounted on a printed circuit board by using strain gauges and an accelerometer to monitor the life-cycle vibration loads. These loads were converted into the compone...