Health Monitoring and Prognostics of Electronics Subject to Vibration Load Conditions

This paper discusses a health monitoring and prognostics methodology for assessing the reliability of a group of electronic components mounted on a printed circuit board by using strain gauges and an accelerometer to monitor the life-cycle vibration loads. These loads were converted into the compone...

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Bibliographic Details
Published inIEEE sensors journal Vol. 9; no. 11; pp. 1479 - 1485
Main Authors Jie Gu, Barker, D., Pecht, M.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.11.2009
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Accelerometer
Accelerometers
Capacitive sensors
Circuit boards
Condition monitoring
Consumption
Electrical resistance measurement
Electronic components
Electronics
Estimates
Fatigue
Fatigue failure
health monitoring
Integrated circuit interconnections
Life estimation
Mathematical models
Monitors
printed circuit board
Printed circuits
prognostics
reliability
strain gauge
Stress
Vibration
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Summary:This paper discusses a health monitoring and prognostics methodology for assessing the reliability of a group of electronic components mounted on a printed circuit board by using strain gauges and an accelerometer to monitor the life-cycle vibration loads. These loads were converted into the component interconnects' stress values, which were then used in a vibration failure fatigue model for damage assessment. Damage estimates were accumulated using Miner's rule and then used to predict the life consumed and remaining life. The results were verified by experimentally measuring component lives through real-time daisy-chain resistance measurements.
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ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2009.2026988