Enhancement of Device Performance in LDMOSFET by Using Dual-Work-Function-Gate Technique
In this letter, we propose a new lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) with dual-work-function-gate (DWG) structure fabricated by utilizing silicidation of poly-Si layer. The step-etched poly-Si layer in the source side of the gate was totally converted...
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Published in | IEEE electron device letters Vol. 31; no. 8; pp. 848 - 850 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.08.2010
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
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Abstract | In this letter, we propose a new lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) with dual-work-function-gate (DWG) structure fabricated by utilizing silicidation of poly-Si layer. The step-etched poly-Si layer in the source side of the gate was totally converted to Ni-rich silicide, which resulted in a higher work function. On the other hand, in the drain side, only the upper part of the nonetched poly-Si layer was silicided, and the remaining lower part of the poly-Si layer was considered to be a gate with a lower work function. The fabricated DWG-LDMOSFET demonstrated remarkable improvement in device performances, such as 16.7, 16.4, 3.3, and 6.4% improvement in saturation drain current, in field-effect mobility, in subthreshold slope, and in the on resistance, respectively, while keeping almost the same breakdown voltage of 26 V and exhibiting less self-heating effect compared with the conventional single-work-function-gate LDMOSFET. |
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AbstractList | In this letter, we propose a new lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) with dual-work-function-gate (DWG) structure fabricated by utilizing silicidation of poly-Si layer. The step-etched poly-Si layer in the source side of the gate was totally converted to Ni-rich silicide, which resulted in a higher work function. On the other hand, in the drain side, only the upper part of the nonetched poly-Si layer was silicided, and the remaining lower part of the poly-Si layer was considered to be a gate with a lower work function. The fabricated DWG-LDMOSFET demonstrated remarkable improvement in device performances, such as 16.7, 16.4, 3.3, and 6.4% improvement in saturation drain current, in field-effect mobility, in subthreshold slope, and in the on resistance, respectively, while keeping almost the same breakdown voltage of 26 V and exhibiting less self-heating effect compared with the conventional single-work-function-gate LDMOSFET. |
Author | Ki-Ju Baek Hee-Sung Kang Jong-Bong Ha Jung-Hee Lee |
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CitedBy_id | crossref_primary_10_1109_ACCESS_2020_3034572 crossref_primary_10_4313_JKEM_2012_25_9_671 crossref_primary_10_1007_s00339_020_3453_4 crossref_primary_10_1016_j_sse_2014_07_004 crossref_primary_10_1109_TED_2012_2219865 crossref_primary_10_1109_TED_2013_2278974 crossref_primary_10_1049_el_2013_1301 |
Cites_doi | 10.1109/16.85161 10.1109/16.936703 10.1109/APEC.2009.4802896 10.1109/TED.2008.2011723 10.1109/LED.2005.861404 10.1016/j.cap.2009.04.011 10.1143/JJAP.45.1525 |
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Snippet | In this letter, we propose a new lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) with dual-work-function-gate (DWG)... |
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SubjectTerms | Automotive engineering Devices Double-gate FETs Drains Driver circuits Dual-work-function gate (DWG) Electric potential Flat panel displays Gates Intermetallics lateral double-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) mobility MOSFETs Nickel nickel silicide Performance enhancement Power dissipation self-heating Silicidation Silicides Voltage Work functions |
Title | Enhancement of Device Performance in LDMOSFET by Using Dual-Work-Function-Gate Technique |
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