Comparative Evaluation of Advanced Three-Phase Three-Level Inverter/Converter Topologies Against Two-Level Systems
Efficient energy conversion in low-voltage applications has gained more attention due to increasing energy costs and environmental issues. Accordingly, three-level converters have been discussed as an alternative to the standard two-level voltage-source converter because they offer an increased effi...
Saved in:
Published in | IEEE transactions on industrial electronics (1982) Vol. 60; no. 12; pp. 5515 - 5527 |
---|---|
Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.12.2013
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Efficient energy conversion in low-voltage applications has gained more attention due to increasing energy costs and environmental issues. Accordingly, three-level converters have been discussed as an alternative to the standard two-level voltage-source converter because they offer an increased efficiency at higher switching frequencies. From a system perspective, the benefits of using three-level converters are not only limited to the converter itself, but there are additional positive impacts on the surrounding such as on the load machine losses or on the electromagnetic interference input filter volume. In this paper, a holistic comparison of advanced three-level topologies against the two-level topology is given. Simple analytical calculations and measurements show the benefits and the optimization potential concerning several aspects, such as the necessary semiconductor chip area, the harmonic losses in the load machine and in filter components, and the volume of passive components. |
---|---|
AbstractList | Efficient energy conversion in low-voltage applications has gained more attention due to increasing energy costs and environmental issues. Accordingly, three-level converters have been discussed as an alternative to the standard two-level voltage-source converter because they offer an increased efficiency at higher switching frequencies. From a system perspective, the benefits of using three-level converters are not only limited to the converter itself, but there are additional positive impacts on the surrounding such as on the load machine losses or on the electromagnetic interference input filter volume. In this paper, a holistic comparison of advanced three-level topologies against the two-level topology is given. Simple analytical calculations and measurements show the benefits and the optimization potential concerning several aspects, such as the necessary semiconductor chip area, the harmonic losses in the load machine and in filter components, and the volume of passive components. |
Author | Kolar, J. W. Schweizer, M. Friedli, T. |
Author_xml | – sequence: 1 givenname: M. surname: Schweizer fullname: Schweizer, M. email: schweizer@lem.ee.ethz.ch organization: Power Electron. Syst. Lab., ETH Zurich, Zurich, Switzerland – sequence: 2 givenname: T. surname: Friedli fullname: Friedli, T. email: thomas.friedli@ieee.org organization: Power Electron. Syst. Lab., ETH Zurich, Zurich, Switzerland – sequence: 3 givenname: J. W. surname: Kolar fullname: Kolar, J. W. email: kolar@lem.ee.ethz.ch organization: Power Electron. Syst. Lab., ETH Zurich, Zurich, Switzerland |
BookMark | eNpdkU1LAzEQhoMoWD_ugpcFL162ZvKxmxxLqVooKLieQ5rO6sp2U5Ptiv_eSBcPnuad4Zlh4Dkjx53vkJAroFMAqu-q5WLKKLApY5wXWh2RCUhZ5loLdUwmlJUqp1QUp-Qsxg9KQUiQExLmfruzwfbNgNlisO0-Rd9lvs5mm8F2DjdZ9R4Q8-d3G3HMKxywzZbdgKHHcDf3Y8oqv_Otf2swZrM323Sxz6ovP_Iv37HHbbwgJ7VtI16O9Zy83i-q-WO-enpYzmer3HEm-pyvnVKSci2pdAq4ZBsNdSm4FqnRUG6E5coprW2aOMVq5RJRaKDSrsWan5Pbw91d8J97jL3ZNtFh29oO_T4aEFBqYELJhN78Qz_8PnTpOwO8BMY0LcpE0QPlgo8xYG12odna8G2Aml8JJkkwvxLMKCGtXB9WGkT8wwuuaAGC_wAUj4OJ |
CODEN | ITIED6 |
CitedBy_id | crossref_primary_10_3390_pr11051463 crossref_primary_10_1109_TIA_2023_3288500 crossref_primary_10_1007_s00502_021_00913_1 crossref_primary_10_1109_JESTPE_2017_2779161 crossref_primary_10_1109_TPEL_2020_3028419 crossref_primary_10_1109_TPEL_2024_3381794 crossref_primary_10_1016_j_conengprac_2024_106006 crossref_primary_10_3390_electronics10121453 crossref_primary_10_1109_TPEL_2017_2730038 crossref_primary_10_1049_pel2_12234 crossref_primary_10_1109_ACCESS_2021_3108188 crossref_primary_10_1109_TPEL_2020_2970005 crossref_primary_10_1109_TPEL_2020_3018857 crossref_primary_10_1109_TIA_2022_3183029 crossref_primary_10_1109_TPEL_2015_2498107 crossref_primary_10_1109_TPEL_2019_2951754 crossref_primary_10_1109_TIE_2016_2570202 crossref_primary_10_1049_rpg2_12655 crossref_primary_10_1109_TPEL_2019_2957699 crossref_primary_10_23919_CJEE_2022_000027 crossref_primary_10_1109_TIE_2018_2823662 crossref_primary_10_6113_JPE_2014_14_3_488 crossref_primary_10_1007_s00202_023_01779_6 crossref_primary_10_30941_CESTEMS_2022_00018 crossref_primary_10_1109_TPEL_2017_2688370 crossref_primary_10_7467_KSAE_2022_30_10_785 crossref_primary_10_1109_TPEL_2019_2897061 crossref_primary_10_1109_TPEL_2019_2932890 crossref_primary_10_1109_TIA_2021_3063075 crossref_primary_10_1109_TIE_2021_3084159 crossref_primary_10_1049_iet_pel_2015_0369 crossref_primary_10_3390_en11071886 crossref_primary_10_1109_JESTPE_2018_2833631 crossref_primary_10_3390_en14175580 crossref_primary_10_1109_TEC_2021_3075964 crossref_primary_10_1109_JESTPE_2022_3164804 crossref_primary_10_1109_TPEL_2018_2827989 crossref_primary_10_1109_TPEL_2021_3089578 crossref_primary_10_1109_TPEL_2022_3141268 crossref_primary_10_1088_1757_899X_186_1_012025 crossref_primary_10_3390_en12101851 crossref_primary_10_1109_TIE_2018_2880723 crossref_primary_10_1109_JESTPE_2021_3103075 crossref_primary_10_1016_j_aej_2023_10_051 crossref_primary_10_1109_ACCESS_2022_3170098 crossref_primary_10_1109_TPEL_2022_3232996 crossref_primary_10_1515_ijeeps_2021_0040 crossref_primary_10_1109_JESTPE_2023_3277192 crossref_primary_10_1109_TEC_2015_2494640 crossref_primary_10_1007_s40031_018_0357_1 crossref_primary_10_1109_JESTPE_2020_3002192 crossref_primary_10_1109_TIE_2022_3176309 crossref_primary_10_5370_JEET_2015_10_2_586 crossref_primary_10_1109_TIA_2014_2387473 crossref_primary_10_1109_ACCESS_2022_3228161 crossref_primary_10_1109_TPEL_2023_3262758 crossref_primary_10_1109_TSTE_2018_2877439 crossref_primary_10_1109_TPEL_2016_2582344 crossref_primary_10_1002_cta_3422 crossref_primary_10_1109_TIE_2018_2814020 crossref_primary_10_1109_TEC_2023_3247432 crossref_primary_10_1109_TPEL_2024_3377352 crossref_primary_10_3390_en12234571 crossref_primary_10_1109_TPEL_2019_2954288 crossref_primary_10_3390_electronics10182244 crossref_primary_10_1109_OJPEL_2022_3147769 crossref_primary_10_1109_ACCESS_2019_2953784 crossref_primary_10_1109_TIA_2020_2988014 crossref_primary_10_3390_electronics9030399 crossref_primary_10_1007_s00202_017_0597_0 crossref_primary_10_1109_TIA_2018_2866565 crossref_primary_10_1109_TIA_2023_3245587 crossref_primary_10_1109_TPEL_2017_2772025 crossref_primary_10_1109_TIE_2019_2899564 crossref_primary_10_1109_JESTPE_2016_2605702 crossref_primary_10_1109_TEC_2023_3305018 crossref_primary_10_1109_ACCESS_2020_3007791 crossref_primary_10_1109_TIA_2017_2695442 crossref_primary_10_1109_TIA_2020_3034888 crossref_primary_10_6113_JPE_2014_14_6_1119 crossref_primary_10_1109_JESTPE_2021_3103252 crossref_primary_10_1109_TIE_2022_3208607 crossref_primary_10_1109_TPEL_2020_2984698 crossref_primary_10_1049_iet_pel_2019_0769 crossref_primary_10_1109_TPEL_2018_2834226 crossref_primary_10_1007_s00202_021_01290_w crossref_primary_10_3390_electronics9081233 crossref_primary_10_1109_TPEL_2021_3099844 crossref_primary_10_1002_cta_3645 crossref_primary_10_3390_en14051303 crossref_primary_10_1109_ACCESS_2021_3102049 crossref_primary_10_1109_TIE_2018_2811370 crossref_primary_10_1109_TIE_2017_2682800 crossref_primary_10_1155_2019_3238159 crossref_primary_10_3390_aerospace11030192 crossref_primary_10_1016_j_gloei_2020_01_006 crossref_primary_10_1109_JESTPE_2020_3008246 crossref_primary_10_1109_TIE_2023_3239941 crossref_primary_10_3390_electronics8020155 crossref_primary_10_3390_en13071855 crossref_primary_10_1109_TPEL_2018_2872327 crossref_primary_10_1109_TPEL_2022_3224125 crossref_primary_10_1080_09398368_2020_1725860 crossref_primary_10_1088_1755_1315_358_4_042071 crossref_primary_10_3390_en16186710 crossref_primary_10_1109_MIE_2017_2693421 crossref_primary_10_1109_TIE_2020_2998752 crossref_primary_10_1109_OJPEL_2024_3394548 crossref_primary_10_1109_TIA_2023_3252521 crossref_primary_10_1109_TSTE_2016_2586941 crossref_primary_10_3390_en13051227 crossref_primary_10_1109_TPEL_2017_2664068 crossref_primary_10_1109_TIA_2017_2771498 crossref_primary_10_1016_j_ref_2017_02_004 crossref_primary_10_1049_iet_est_2015_0010 crossref_primary_10_1049_pel2_12665 crossref_primary_10_1109_TIE_2016_2607160 crossref_primary_10_1109_TPEL_2017_2784821 crossref_primary_10_1049_iet_pel_2017_0358 crossref_primary_10_1109_TTE_2022_3205035 crossref_primary_10_3390_math12132116 crossref_primary_10_3390_electronics9091437 crossref_primary_10_1109_TCSII_2021_3082580 crossref_primary_10_1109_MIE_2020_3008022 crossref_primary_10_1109_TIA_2016_2639462 crossref_primary_10_1109_TIA_2018_2851561 crossref_primary_10_3390_inventions9020037 crossref_primary_10_1109_JESTPE_2023_3304338 crossref_primary_10_3390_electronics11111686 crossref_primary_10_1109_TIE_2014_2385652 crossref_primary_10_1088_1742_6596_1706_1_012104 crossref_primary_10_1109_JESTPE_2022_3146581 crossref_primary_10_1016_j_ijhydene_2016_01_140 crossref_primary_10_1109_TTE_2020_3006045 crossref_primary_10_1109_JESTPE_2016_2517819 crossref_primary_10_1109_JESTPE_2019_2956315 crossref_primary_10_1109_TIA_2019_2920360 crossref_primary_10_1109_TIE_2019_2955420 crossref_primary_10_3390_en11102774 crossref_primary_10_1109_TEC_2018_2852219 crossref_primary_10_1109_TVT_2019_2897899 crossref_primary_10_3390_wevj13070113 crossref_primary_10_1109_JESTPE_2014_2310140 crossref_primary_10_1109_TIE_2016_2607155 crossref_primary_10_2478_pead_2021_0011 crossref_primary_10_1109_TTE_2019_2962333 crossref_primary_10_1109_ACCESS_2019_2922741 crossref_primary_10_1109_ACCESS_2021_3122922 crossref_primary_10_1109_TEC_2023_3294301 crossref_primary_10_1109_TIE_2020_2977575 crossref_primary_10_1109_JESTPE_2022_3219377 crossref_primary_10_6113_JPE_2016_16_1_182 crossref_primary_10_1109_TIE_2014_2351378 crossref_primary_10_1109_OJIA_2022_3179225 crossref_primary_10_3390_en13010141 crossref_primary_10_1109_TSTE_2020_3038744 crossref_primary_10_1109_TPEL_2014_2321775 crossref_primary_10_1109_TPEL_2020_3008817 crossref_primary_10_1109_TIE_2021_3050347 crossref_primary_10_1109_JESTPE_2021_3106157 crossref_primary_10_1109_ACCESS_2020_2980814 crossref_primary_10_1109_ACCESS_2020_2993283 crossref_primary_10_1002_cta_3737 crossref_primary_10_3390_electronics8060677 crossref_primary_10_1007_s40998_023_00653_2 crossref_primary_10_1007_s13369_018_3506_6 crossref_primary_10_1109_JESTPE_2019_2908672 crossref_primary_10_1109_TIE_2018_2851967 crossref_primary_10_1109_OJIA_2021_3091549 crossref_primary_10_1109_TIE_2018_2793231 crossref_primary_10_1109_TIE_2018_2835372 crossref_primary_10_1007_s43236_023_00626_y crossref_primary_10_1049_pel2_12408 crossref_primary_10_1109_TPEL_2023_3289508 crossref_primary_10_3390_en14175280 crossref_primary_10_1109_TIE_2017_2682796 |
Cites_doi | 10.1109/07IAS.2007.187 10.1109/TIE.2007.906997 10.1049/ip-epa:19970989 10.1109/TIE.2011.2161061 10.1049/piee.1968.0311 10.1109/OPTIM.2010.5510569 10.1109/APEC.2010.5433434 10.1109/08IAS.2008.50 10.1109/PECI.2012.6184594 10.1109/TIA.2002.802920 10.1109/TIA.2010.2040055 10.1109/28.108456 10.1109/TIE.2010.2049719 10.1109/TPEL.2008.2002329 10.1109/PESC.1992.254709 10.1109/TIE.2002.803207 10.1109/TIE.2005.847586 10.1109/IECON.2011.6119603 10.1109/TIE.2011.2159353 10.1109/TIE.2010.2093480 10.1109/TIA.1981.4503992 10.1109/IECON.2010.5674994 10.1109/TIE.2009.2032430 10.1109/TIA.2010.2057393 10.1109/TIA.2009.2027530 10.1109/APEC.2009.4802678 10.1109/TIA.2005.847285 10.1109/TIE.2009.2024095 |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Dec 2013 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Dec 2013 |
DBID | 97E RIA RIE AAYXX CITATION 7SP 8FD L7M F28 FR3 |
DOI | 10.1109/TIE.2012.2233698 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace ANTE: Abstracts in New Technology & Engineering Engineering Research Database |
DatabaseTitle | CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts Engineering Research Database ANTE: Abstracts in New Technology & Engineering |
DatabaseTitleList | Engineering Research Database Technology Research Database |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1557-9948 |
EndPage | 5527 |
ExternalDocumentID | 3004664911 10_1109_TIE_2012_2233698 6380614 |
Genre | orig-research |
GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E 9M8 AAJGR AASAJ ABQJQ ABVLG ACGFO ACGFS ACIWK ACKIV ACNCT AENEX AETIX AI. AIBXA AKJIK ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ H~9 IBMZZ ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 MS~ O9- OCL P2P RIA RIE RIG RNS TAE TN5 TWZ VH1 VJK XFK AAYXX CITATION 7SP 8FD L7M F28 FR3 |
ID | FETCH-LOGICAL-c324t-3bc885039505c81352d91f74394135917d4a38c899a941c82f8cd9169105ab4b3 |
IEDL.DBID | RIE |
ISSN | 0278-0046 |
IngestDate | Wed Jul 24 12:38:39 EDT 2024 Thu Oct 10 18:23:40 EDT 2024 Fri Aug 23 01:00:25 EDT 2024 Wed Jun 26 19:27:54 EDT 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 12 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c324t-3bc885039505c81352d91f74394135917d4a38c899a941c82f8cd9169105ab4b3 |
Notes | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
PQID | 1371229067 |
PQPubID | 85464 |
PageCount | 13 |
ParticipantIDs | proquest_miscellaneous_1417912485 crossref_primary_10_1109_TIE_2012_2233698 proquest_journals_1371229067 ieee_primary_6380614 |
PublicationCentury | 2000 |
PublicationDate | 2013-12-01 |
PublicationDateYYYYMMDD | 2013-12-01 |
PublicationDate_xml | – month: 12 year: 2013 text: 2013-12-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE transactions on industrial electronics (1982) |
PublicationTitleAbbrev | TIE |
PublicationYear | 2013 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref35 ref13 peron-guennegues (ref16) 2011 ruderman (ref32) 2005; 1 ref34 ref12 ref15 ref36 ref14 ref31 ref30 ref33 ref11 ref10 ref2 ref1 ref17 steinke (ref7) 1988; 10 ref19 ref18 fuld (ref9) 1989; 11 joetten (ref8) 1985 ref24 ref23 ref26 ref25 ref20 holtz (ref6) 1977; 6 ref22 novotny (ref28) 1990 ref27 ref29 schweizer (ref21) 2011 ref4 ref3 ref5 |
References_xml | – ident: ref25 doi: 10.1109/07IAS.2007.187 – ident: ref14 doi: 10.1109/TIE.2007.906997 – volume: 11 start-page: 261 year: 1989 ident: ref9 article-title: Aufwandsarmer Thyristor-Dreistufen-Wechselrichter mit geringen Verlusten (in german) publication-title: EtzArchiv contributor: fullname: fuld – ident: ref18 doi: 10.1049/ip-epa:19970989 – volume: 6 start-page: 164 year: 1977 ident: ref6 publication-title: Siemens Forschungs- und Entwicklungsberichte contributor: fullname: holtz – ident: ref26 doi: 10.1109/TIE.2011.2161061 – ident: ref31 doi: 10.1049/piee.1968.0311 – ident: ref29 doi: 10.1109/OPTIM.2010.5510569 – start-page: 1 year: 2011 ident: ref21 article-title: High efficiency drive system with 3-level T-type inverter publication-title: Proc 14th Eur Conf EPE contributor: fullname: schweizer – ident: ref15 doi: 10.1109/APEC.2010.5433434 – ident: ref24 doi: 10.1109/08IAS.2008.50 – start-page: 1 year: 2011 ident: ref16 article-title: A converter topology for high current density drive applications publication-title: Proc 14th Eur Conf EPE contributor: fullname: peron-guennegues – ident: ref36 doi: 10.1109/PECI.2012.6184594 – start-page: 233 year: 1990 ident: ref28 article-title: Frequency dependence of time harmonic losses in induction machines publication-title: Proc Int Conf Elect Mach contributor: fullname: novotny – ident: ref3 doi: 10.1109/TIA.2002.802920 – volume: 1 start-page: 58 year: 2005 ident: ref32 article-title: Electrical machine PWM loss evaluation basics publication-title: Proc 4th Int Conf EEMODS contributor: fullname: ruderman – ident: ref33 doi: 10.1109/TIA.2010.2040055 – ident: ref19 doi: 10.1109/28.108456 – ident: ref17 doi: 10.1109/TIE.2010.2049719 – ident: ref30 doi: 10.1109/TPEL.2008.2002329 – ident: ref10 doi: 10.1109/PESC.1992.254709 – ident: ref20 doi: 10.1109/TIE.2002.803207 – ident: ref12 doi: 10.1109/TIE.2005.847586 – start-page: 3.1 year: 1985 ident: ref8 article-title: AC drive with three-level voltage source inverter and high dynamic performance microprocessor control publication-title: Proc Eur Conf EPE contributor: fullname: joetten – ident: ref35 doi: 10.1109/IECON.2011.6119603 – ident: ref13 doi: 10.1109/TIE.2011.2159353 – ident: ref4 doi: 10.1109/TIE.2010.2093480 – ident: ref5 doi: 10.1109/TIA.1981.4503992 – ident: ref1 doi: 10.1109/IECON.2010.5674994 – ident: ref22 doi: 10.1109/TIE.2009.2032430 – ident: ref34 doi: 10.1109/TIA.2010.2057393 – ident: ref11 doi: 10.1109/TIA.2009.2027530 – volume: 10 start-page: 215 year: 1988 ident: ref7 article-title: Grundlagen f r die Entwicklung eines Steuerverfahrens f r GTO-Dreipunktwechselrichter f r Traktionsantriebe (in German) publication-title: EtzArchiv contributor: fullname: steinke – ident: ref23 doi: 10.1109/APEC.2009.4802678 – ident: ref2 doi: 10.1109/TIA.2005.847285 – ident: ref27 doi: 10.1109/TIE.2009.2024095 |
SSID | ssj0014515 |
Score | 2.6104462 |
Snippet | Efficient energy conversion in low-voltage applications has gained more attention due to increasing energy costs and environmental issues. Accordingly,... |
SourceID | proquest crossref ieee |
SourceType | Aggregation Database Publisher |
StartPage | 5515 |
SubjectTerms | Comparison Converters Insulated gate bipolar transistors Inverters losses Mathematical analysis Optimization Passive components Semiconductor diodes Semiconductors Switches Switching Switching frequency Switching loss three-level Topology volume |
Title | Comparative Evaluation of Advanced Three-Phase Three-Level Inverter/Converter Topologies Against Two-Level Systems |
URI | https://ieeexplore.ieee.org/document/6380614 https://www.proquest.com/docview/1371229067 https://search.proquest.com/docview/1417912485 |
Volume | 60 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8NAEB5qT3rwVcVolRW8CCbNs8keS2mpYsVDCr2F7GajIiRSWwR_vTPJNj4P3pZkEsLO7s43mZlvAC5EHqZS4k6TjhuavuuHpsj7Eg9D4biZl4ksoALn6V1_MvNv5sG8BVdNLYxSqko-UxYNq1h-VsoV_Srr4VohB2YDNkLO61qtJmLgB3W3ApcYY9HpW4ckbd6Lr0eUw-VaaAq9Po--maCqp8qvg7iyLuMdmK6_q04qebZWS2HJ9x-Ujf_98F3Y1jCTDep1sQctVezD1hfywQ4shp_E32zUkH6zMmcDnRjAYtS0Mu8f0dTp8S0lGTFi56Bc0N6w1CMW190W0PFmg4f0CVEni99KLa950Q9gNh7Fw4mpOzCYEoHW0vSEjKLA9jjiJBk5CNYy7uTkw6DtC9DTy_zUiyT6bClekZGbRxIl-ohBglT4wjuEdlEW6giYm-NzQeaLFAEnHhsi4lSly-3MEVTGbcDlWinJS020kVQOis0TVGBCCky0Ag3o0Bw3cnp6DeiutZjonfiaOF7oVJz2oQHnzW3cQxQYSQtVrlCG2rA5RO52_PebT2DTpTYYVRpLF9rLxUqdIhhZirNqFX4Aio7a-g |
link.rule.ids | 315,783,787,799,27936,27937,55086 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8NAEB5qPagH32K16gpeBNM2782xlJZW2-Ihhd5CdrNRERqpLYK_3plkG58Hb0syCWFnd-ebzMw3AFci9WMpcadJ0_INx3J8Q6SexMNQmFZiJyJxqcB5NPb6E-d26k4rcFPWwiil8uQz1aBhHstPMrmkX2VNXCvkwKzBOuJq7hXVWmXMwHGLfgUWccai27cKSraCZjjoUhaX1UBjaHsB_2aE8q4qv47i3L70dmC0-rIireS5sVyIhnz_Qdr430_fhW0NNFm7WBl7UFGzfdj6Qj94APPOJ_U365a03yxLWVunBrAQda2M-0c0dno8pDQjRvwclA3a7GR6xMKi3wK63qz9ED8h7mThW6blNTP6IUx63bDTN3QPBkMi1FoYtpCcuy07QKQkuYlwLQnMlLwYtH4u-nqJE9tcotcW4xXJrZRLlPAQhbixcIR9BNVZNlPHwKwUn3MTR8QIOfHgEDygOt2glZiCCrlrcL1SSvRSUG1EuYvSCiJUYEQKjLQCa3BAc1zK6emtQX2lxUjvxdfItH0zZ7X3a3BZ3sZdRKGReKayJcpQIzaT6N1O_n7zBWz0w9EwGg7Gd6ewaVFTjDyppQ7VxXypzhCaLMR5viI_ACZh3kU |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Comparative+Evaluation+of+Advanced+Three-Phase+Three-Level+Inverter%2FConverter+Topologies+Against+Two-Level+Systems&rft.jtitle=IEEE+transactions+on+industrial+electronics+%281982%29&rft.au=Schweizer%2C+Mario&rft.au=Friedli%2C+Thomas&rft.au=Kolar%2C+Johann+W.&rft.date=2013-12-01&rft.issn=0278-0046&rft.eissn=1557-9948&rft.volume=60&rft.issue=12&rft.spage=5515&rft.epage=5527&rft_id=info:doi/10.1109%2FTIE.2012.2233698&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_TIE_2012_2233698 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0278-0046&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0278-0046&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0278-0046&client=summon |