The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages

• Published in: IEEE transactions on components and packaging technologies Vol. 29; no. 3; pp. 522 - 527
• Main Authors: Lin, T.Y., Pecht, M.G., Das, D., Kiat Choon Teo
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.09.2006; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Adhesives; Copper; Delaminating; Delamination; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Green electronics; Lead; lead free soldering; Masks; Moisture; moisture sensitivity level (MSL); Molds; Packages; plastic ball-grid array (PBGA); Plastic packaging; Reflow soldering; Solders; Surface mount technology
• ISSN: 1521-3331; 1557-9972
• DOI: 10.1109/TCAPT.2006.880450

As the electronics industry migrates to the lead- and halogen-free (green) packages, many of the materials used in plastic ball-grid array (PBGA) substrates, in particular the molding compounds and die attaches, will have to be improved. The moisture sensitivity level (MSL) performance of the large...