Lai, Z., Cui, Y., Zhao, T., & Wu, Q. (2022). Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course. Electronics (Basel), 11(9), 1437. https://doi.org/10.3390/electronics11091437
Chicago Style (17th ed.) CitationLai, Ziliang, Yansong Cui, Tonggang Zhao, and Qiang Wu. "Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course." Electronics (Basel) 11, no. 9 (2022): 1437. https://doi.org/10.3390/electronics11091437.
MLA (9th ed.) CitationLai, Ziliang, et al. "Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course." Electronics (Basel), vol. 11, no. 9, 2022, p. 1437, https://doi.org/10.3390/electronics11091437.
Warning: These citations may not always be 100% accurate.