Prediction of steady-state creep strain rate and rupture life for SnAg-based Lead-free solder joints by SP test - Yang, Zheng-Jie; Yu, Hyo-Sun; Yang, Sung-Mo; Song, Joon-Hyuk; Park, So-Young (International journal of precision engineering and manufacturing, 2013)
Keywords: Engineering; Industrial and Production Engineering; Materials Science; Fractured solder joints; SnAg-based lead-free solder joint; Rupture life; Steady-state creep; SP test; Strain rate