Detection of small-size solder ball defects through heat conduction analysis

• Published in: Review of scientific instruments Vol. 89; no. 2; pp. 024905 - 24910
• Main Authors: Zhou, Xiuyun, Chen, Yaqiu, Lu, Xiaochuan
• Format: Journal Article
• Language: English
• Published: United States 01.02.2018

Aiming to solve the defect detection problem of a small-size solder ball in the high density chip, heat conduction analysis based on eddy current pulsed thermography is put forward to differentiate various defects. With establishing the 3D finite element model about induction heating, defects such a...