APA (7th ed.) Citation

Zhou, X., Chen, Y., & Lu, X. (2018). Detection of small-size solder ball defects through heat conduction analysis. Review of scientific instruments, 89(2), 024905-24910. https://doi.org/10.1063/1.5003674

Chicago Style (17th ed.) Citation

Zhou, Xiuyun, Yaqiu Chen, and Xiaochuan Lu. "Detection of Small-size Solder Ball Defects Through Heat Conduction Analysis." Review of Scientific Instruments 89, no. 2 (2018): 024905-24910. https://doi.org/10.1063/1.5003674.

MLA (9th ed.) Citation

Zhou, Xiuyun, et al. "Detection of Small-size Solder Ball Defects Through Heat Conduction Analysis." Review of Scientific Instruments, vol. 89, no. 2, 2018, pp. 024905-24910, https://doi.org/10.1063/1.5003674.