Fundamental properties of intrinsic gettering of iron in a silicon wafer

Properties of intrinsic gettering of Fe were studied by measuring Fe-B complex concentration and interstitial Fe concentration in a denuded zone after isochronal or isothermal annealing followed by quenching using deep level transient spectroscopy. We calculated the Fe concentration as the Fe-B comp...

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Published inJournal of applied physics Vol. 72; no. 3; pp. 895 - 898
Main Authors AOKI, M, HARA, A, OHSAWA, A
Format Journal Article
LanguageEnglish
Published Woodbury, NY American Institute of Physics 01.08.1992
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Abstract Properties of intrinsic gettering of Fe were studied by measuring Fe-B complex concentration and interstitial Fe concentration in a denuded zone after isochronal or isothermal annealing followed by quenching using deep level transient spectroscopy. We calculated the Fe concentration as the Fe-B complex concentration plus the interstitial Fe concentration. Silicon wafers were contaminated with a surface Fe concentration of 4.2×1011 to 3.2×1013 cm−2 to show the relation between Fe concentration in the wafer and the temperature at which gettering occurs. Supersaturation of Fe impurities was found necessary for intrinsic gettering of Fe in the contamination range of 4.0×1012 to 3.5×1014 cm−3. Therefore, the gettering temperature is lower for low-level Fe contamination than for high-level contamination. The reduction of Fe concentration saturated with annealing time, which shows that the oxygen precipitates in the bulk defect region do not work as an infinite gettering sink. We found that the saturated Fe concentration follows a simple Arrhenius relationship, so that gettering stops at the thermal equilibrium concentration. We think that in intrinsic gettering, Fe precipitates preferentially in the bulk defect region when the Fe impurities supersaturate with decreasing temperature.
AbstractList Properties of intrinsic gettering of Fe were studied by measuring Fe-B complex concentration and interstitial Fe concentration in a denuded zone after isochronal or isothermal annealing followed by quenching using deep level transient spectroscopy. We calculated the Fe concentration as the Fe-B complex concentration plus the interstitial Fe concentration. Silicon wafers were contaminated with a surface Fe concentration of 4.2×1011 to 3.2×1013 cm−2 to show the relation between Fe concentration in the wafer and the temperature at which gettering occurs. Supersaturation of Fe impurities was found necessary for intrinsic gettering of Fe in the contamination range of 4.0×1012 to 3.5×1014 cm−3. Therefore, the gettering temperature is lower for low-level Fe contamination than for high-level contamination. The reduction of Fe concentration saturated with annealing time, which shows that the oxygen precipitates in the bulk defect region do not work as an infinite gettering sink. We found that the saturated Fe concentration follows a simple Arrhenius relationship, so that gettering stops at the thermal equilibrium concentration. We think that in intrinsic gettering, Fe precipitates preferentially in the bulk defect region when the Fe impurities supersaturate with decreasing temperature.
Author HARA, A
OHSAWA, A
AOKI, M
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  fullname: OHSAWA, A
  organization: Fujitsu Laboratories, Ltd, Atsugi 243-01, Japan
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Issue 3
Keywords Complex defect
Deep level transient spectrometry
Semiconductor materials
Impurity density
Czochralski method
Iron
Floating zone
Experimental study
Impurity trapping
Contamination
Boron
Silicon
Thermal annealing
Wafer
Concentration distribution
Language English
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PublicationTitle Journal of applied physics
PublicationYear 1992
Publisher American Institute of Physics
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SubjectTerms Condensed matter: structure, mechanical and thermal properties
Defects and impurities in crystals; microstructure
Exact sciences and technology
Impurities: concentration, distribution, and gradients
Physics
Structure of solids and liquids; crystallography
Title Fundamental properties of intrinsic gettering of iron in a silicon wafer
Volume 72
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