Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

• Published in: Journal of materials science. Materials in electronics Vol. 30; no. 4; pp. 3222 - 3243
• Main Authors: Wang, Fengjiang, Chen, Hong, Huang, Ying, Liu, Luting, Zhang, Zhijie
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.02.2019; Springer Nature B.V
• Subjects: Alloying effects; Alloying elements; Bismuth; Characterization and Evaluation of Materials; Chemistry and Materials Science; Component reliability; Copper; Interface reactions; Lead free; Low temperature; Materials Science; Mechanical properties; Melting points; Optical and Electronic Materials; Review; Silver; Soldering; Solders; Tin; Tin base alloys; Warpage; Wettability

With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer electronic products, Sn–Ag–Cu series solder has been gotten the most application. However, there are some stimulations from electronic manufacturers to adopt low temperature soldering such as the economic dri...