APA (7th ed.) Citation

Wang, F., Chen, H., Huang, Y., Liu, L., & Zhang, Z. (2019). Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. Journal of materials science. Materials in electronics, 30(4), 3222-3243. https://doi.org/10.1007/s10854-019-00701-w

Chicago Style (17th ed.) Citation

Wang, Fengjiang, Hong Chen, Ying Huang, Luting Liu, and Zhijie Zhang. "Recent Progress on the Development of Sn–Bi Based Low-temperature Pb-free Solders." Journal of Materials Science. Materials in Electronics 30, no. 4 (2019): 3222-3243. https://doi.org/10.1007/s10854-019-00701-w.

MLA (9th ed.) Citation

Wang, Fengjiang, et al. "Recent Progress on the Development of Sn–Bi Based Low-temperature Pb-free Solders." Journal of Materials Science. Materials in Electronics, vol. 30, no. 4, 2019, pp. 3222-3243, https://doi.org/10.1007/s10854-019-00701-w.