Contribution of Mechanical Activation on the Growth of Intermetallic Compound Layers at the Cu/Al Interface During Vacuum Hot Pressing - Wu, Shao-peng; Cai, Xiao-lan; Zhou, Lei; Yang, Chang-jiang; Li, Wen-hao; Cheng, Yuan-chao (Transactions of the Indian Institute of Metals, 2022)
Keywords: Aluminum; Ball milling; Chemistry and Materials Science; Copper; Corrosion and Coatings; Diffusion; Emission analysis; Field emission microscopy; Hot pressing; Intermetallic compounds; Materials Science; Metallic Materials; Original Article; Sintering (powder metallurgy); Thickness; Tribology; Hot pressing; Cu/Al interface; Intermetallic compounds; Powder metallurgy; Mechanical activation