A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

• Published in: Journal of materials science. Materials in electronics Vol. 32; no. 6; pp. 6742 - 6777
• Main Authors: Kannojia, Harindra Kumar, Dixit, Pradeep
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.03.2021; Springer Nature B.V
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Design parameters; Electronic packaging; High temperature; Integrated circuits; Interconnections; Interdiffusion; Intermetallic compounds; Materials Science; Optical and Electronic Materials; Reliability; Review; Surface roughness; Surface stability; Tin; Voids

In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias (TSV)-based 3D stacking applications. Due to its specific advantages such as lower cost, less stringent surface uniformity requ...