APA (7th ed.) Citation

Kannojia, H. K., & Dixit, P. (2021). A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging. Journal of materials science. Materials in electronics, 32(6), 6742-6777. https://doi.org/10.1007/s10854-021-05412-9

Chicago Style (17th ed.) Citation

Kannojia, Harindra Kumar, and Pradeep Dixit. "A Review of Intermetallic Compound Growth and Void Formation in Electrodeposited Cu–Sn Layers for Microsystems Packaging." Journal of Materials Science. Materials in Electronics 32, no. 6 (2021): 6742-6777. https://doi.org/10.1007/s10854-021-05412-9.

MLA (9th ed.) Citation

Kannojia, Harindra Kumar, and Pradeep Dixit. "A Review of Intermetallic Compound Growth and Void Formation in Electrodeposited Cu–Sn Layers for Microsystems Packaging." Journal of Materials Science. Materials in Electronics, vol. 32, no. 6, 2021, pp. 6742-6777, https://doi.org/10.1007/s10854-021-05412-9.