Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

• Published in: Journal of electronic materials Vol. 51; no. 3; pp. 1169 - 1179
• Main Authors: Waduge, Gihan Dodanduwa, Baty, Greg, Lee, Young-woo, Lee, Tae-Kyu
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.03.2022; Springer Nature B.V
• Subjects: Aging; Assembly; Bend properties; Bismuth; Characterization and Evaluation of Materials; Chemistry and Materials Science; Diameters; Ductility; Electronics and Microelectronics; Instrumentation; Materials Science; Mechanical properties; Melt temperature; Optical and Electronic Materials; Original Research Article; Room temperature; Shear strength; Shear tests; Soldered joints; Solders; Solid State Physics; Surface finish; Tin base alloys; Warpage; Sn-58Bi; low melting temperature solder; microstructure; Isothermal aging; single-ball shear

Use of low melting temperature solder (LTS) materials in interconnect devices is a recent application as they lower the challenges of high reflow peak temperature-induced package warpage during assembly. A good candidate to overcome this challenge is a eutectic Sn-Bi system solder, with a melting te...