Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability - Waduge, Gihan Dodanduwa; Baty, Greg; Lee, Young-woo; Lee, Tae-Kyu (Journal of electronic materials, 2022)
Keywords: Aging; Assembly; Bend properties; Bismuth; Characterization and Evaluation of Materials; Chemistry and Materials Science; Diameters; Ductility; Electronics and Microelectronics; Instrumentation; Materials Science; Mechanical properties; Melt temperature; Optical and Electronic Materials; Original Research Article; Room temperature; Shear strength; Shear tests; Soldered joints; Solders; Solid State Physics; Surface finish; Tin base alloys; Warpage; Sn-58Bi; low melting temperature solder; microstructure; Isothermal aging; single-ball shear