APA (7th ed.) Citation

Waduge, G. D., Baty, G., Lee, Y., & Lee, T. (2022). Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability. Journal of electronic materials, 51(3), 1169-1179. https://doi.org/10.1007/s11664-021-09379-5

Chicago Style (17th ed.) Citation

Waduge, Gihan Dodanduwa, Greg Baty, Young-woo Lee, and Tae-Kyu Lee. "Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability." Journal of Electronic Materials 51, no. 3 (2022): 1169-1179. https://doi.org/10.1007/s11664-021-09379-5.

MLA (9th ed.) Citation

Waduge, Gihan Dodanduwa, et al. "Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability." Journal of Electronic Materials, vol. 51, no. 3, 2022, pp. 1169-1179, https://doi.org/10.1007/s11664-021-09379-5.