Dielectric properties of hafnium oxide film prepared by HiPIMS at different O2/Ar ratios and their influences on TFT performance

High-k hafnium oxide (HfO2) film was prepared by high power impulse magnetron sputtering (HiPIMS). The influences of oxygen supply on the plasma state, film properties and TFT performance were investigated. The films are near-stoichiometric and preferentially (−1 1 1)-orientated. When the oxygen sup...

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Published inJournal of science. Advanced materials and devices Vol. 9; no. 2; p. 100722
Main Authors Zhao, Ming-Jie, Wang, Yao-Tian, Yan, Jia-Hao, Li, Hai-Cheng, Xu, Hua, Wuu, Dong-Sing, Wu, Wan-Yu, Lai, Feng-Min, Lien, Shui-Yang, Zhu, Wen-Zhang
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LanguageEnglish
Published Elsevier B.V 01.06.2024
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Abstract High-k hafnium oxide (HfO2) film was prepared by high power impulse magnetron sputtering (HiPIMS). The influences of oxygen supply on the plasma state, film properties and TFT performance were investigated. The films are near-stoichiometric and preferentially (−1 1 1)-orientated. When the oxygen supply increased from 1% to 3%, the excitation/ionization rate of the plasma species increased, leading to higher crystallinity, higher density, and lower oxygen vacancy defect concentration of the film, therefore improving the dielectric properties of the film. When the oxygen supply further increased to 5%, the excitation/ionization rate decreased, thereby leading to lower crystallinity, lower density, and higher oxygen vacancy defect concentration of the film, therefore deteriorating the dielectric properties of the film. The film deposited at 3% oxygen supply exhibited the best dielectric properties with the highest k value of 24 and the highest breakdown-electric field (4.7 MV/cm), which should be attributed to the high crystallinity, high density and low oxygen vacancy defect concentration of the film. Finally, transparent thin film transistors (TFTs) with ITO gate electrode, HfO2 gate dielectric layer and indium-gallium-zinc oxide channel were fabricated on flexible colorless polyimide substrate at full room temperature by all HiPIMS process. The fixed positive charges and k value of HfO2 film have significant effects on the TFT performance. The best TFT exhibited good electrical performance, featuring a remarkably low subthreshold swing of 0.13 V/decade. It also exhibited fair stability against bending and gate bias stress.
AbstractList High-k hafnium oxide (HfO2) film was prepared by high power impulse magnetron sputtering (HiPIMS). The influences of oxygen supply on the plasma state, film properties and TFT performance were investigated. The films are near-stoichiometric and preferentially (−1 1 1)-orientated. When the oxygen supply increased from 1% to 3%, the excitation/ionization rate of the plasma species increased, leading to higher crystallinity, higher density, and lower oxygen vacancy defect concentration of the film, therefore improving the dielectric properties of the film. When the oxygen supply further increased to 5%, the excitation/ionization rate decreased, thereby leading to lower crystallinity, lower density, and higher oxygen vacancy defect concentration of the film, therefore deteriorating the dielectric properties of the film. The film deposited at 3% oxygen supply exhibited the best dielectric properties with the highest k value of 24 and the highest breakdown-electric field (4.7 MV/cm), which should be attributed to the high crystallinity, high density and low oxygen vacancy defect concentration of the film. Finally, transparent thin film transistors (TFTs) with ITO gate electrode, HfO2 gate dielectric layer and indium-gallium-zinc oxide channel were fabricated on flexible colorless polyimide substrate at full room temperature by all HiPIMS process. The fixed positive charges and k value of HfO2 film have significant effects on the TFT performance. The best TFT exhibited good electrical performance, featuring a remarkably low subthreshold swing of 0.13 V/decade. It also exhibited fair stability against bending and gate bias stress.
ArticleNumber 100722
Author Li, Hai-Cheng
Wu, Wan-Yu
Zhu, Wen-Zhang
Wang, Yao-Tian
Xu, Hua
Zhao, Ming-Jie
Yan, Jia-Hao
Lien, Shui-Yang
Lai, Feng-Min
Wuu, Dong-Sing
Author_xml – sequence: 1
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  givenname: Yao-Tian
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  organization: Xiamen Key Laboratory of Development and Application for Advanced Semiconductor Coating Technology, The School of Opto-electronic and Communication Engineering, Xiamen University of Technology, Xiamen, Fujian, 361024, China
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  givenname: Dong-Sing
  surname: Wuu
  fullname: Wuu, Dong-Sing
  organization: Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, 54561, Taiwan
– sequence: 7
  givenname: Wan-Yu
  surname: Wu
  fullname: Wu, Wan-Yu
  organization: Department of Materials Science and Engineering, National United University, Miaoli, 360302, Taiwan
– sequence: 8
  givenname: Feng-Min
  surname: Lai
  fullname: Lai, Feng-Min
  organization: Department of Biomedical Engineering, Da-Yeh University, Changhua, 51591, Taiwan
– sequence: 9
  givenname: Shui-Yang
  orcidid: 0000-0002-3289-9538
  surname: Lien
  fullname: Lien, Shui-Yang
  email: sylien@xmut.edu.cn
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– sequence: 10
  givenname: Wen-Zhang
  surname: Zhu
  fullname: Zhu, Wen-Zhang
  organization: Xiamen Key Laboratory of Development and Application for Advanced Semiconductor Coating Technology, The School of Opto-electronic and Communication Engineering, Xiamen University of Technology, Xiamen, Fujian, 361024, China
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Keywords Flexible thin film transistor (TFT)
Hafnium oxide
Oxide semiconductor
High power impulse magnetron sputtering
Room-temperature-fabrication
Language English
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Snippet High-k hafnium oxide (HfO2) film was prepared by high power impulse magnetron sputtering (HiPIMS). The influences of oxygen supply on the plasma state, film...
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SubjectTerms Flexible thin film transistor (TFT)
Hafnium oxide
High power impulse magnetron sputtering
Oxide semiconductor
Room-temperature-fabrication
Title Dielectric properties of hafnium oxide film prepared by HiPIMS at different O2/Ar ratios and their influences on TFT performance
URI https://dx.doi.org/10.1016/j.jsamd.2024.100722
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