Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps

• Published in: Welding in the world Vol. 66; no. 5; pp. 973 - 983
• Main Authors: Zhang, Zhiyuan, Chen, Jieshi, Wang, Jianing, Han, Yuzhu, Yu, Zhiyuan, Wang, Qinzhao, Zhang, Peilei, Yang, Shanglei
• Format: Journal Article
• Language: English
• Published: Berlin/Heidelberg Springer Berlin Heidelberg 01.05.2022; Springer Nature B.V
• Subjects: Chemistry and Materials Science; Copper; Hardness; Intermetallic compounds; Materials Science; Metallic Materials; Nanoindentation; Research Paper; Solders; Solid Mechanics; Theoretical and Applied Mechanics; Thickness; Tin; Binary diffusion; IMCs; Solder thickness; Cu/Sn/Cu microbumps; Nanoindentation

The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect on the interfacial transfer and the performance. During the reflow stage, it was found that the grains of Cu 6 Sn 5 sho...