Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps - Zhang, Zhiyuan; Chen, Jieshi; Wang, Jianing; Han, Yuzhu; Yu, Zhiyuan; Wang, Qinzhao; Zhang, Peilei; Yang, Shanglei (Welding in the world, 2022)
Keywords: Chemistry and Materials Science; Copper; Hardness; Intermetallic compounds; Materials Science; Metallic Materials; Nanoindentation; Research Paper; Solders; Solid Mechanics; Theoretical and Applied Mechanics; Thickness; Tin; Binary diffusion; IMCs; Solder thickness; Cu/Sn/Cu microbumps; Nanoindentation