Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects

• Published in: Journal of materials engineering and performance Vol. 28; no. 4; pp. 2292 - 2304
• Main Authors: Chang, Chang-Shuo, Wang, Da-Jiun, Li, Tse-Chang, Shen, Chang-Hong, Jing, Yuan-Chou, Wu, Gien-Huang, Lin, Jen-Fin
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.04.2019
• Subjects: ANNEALING; CARBON; Characterization and Evaluation of Materials; Chemistry and Materials Science; COPPER; Corrosion and Coatings; ELECTRIC CONDUCTIVITY; Engineering Design; LEAKAGE CURRENT; MATERIALS SCIENCE; PERMITTIVITY; Quality Control; Reliability; Safety and Risk; SILICA; SILICON OXIDES; Tribology; diffusion barrier; ultrathin carbon film; electrical properties; rapid thermal annealing; nano-copper wire

Four specimen patterns with the microstructure of a microcopper wire are deposited on the Si-wafer substrate plus thermal oxide (SiO 2 ) film as the top layer. Each pattern was prepared to have two kinds of specimens, including with and without ultrathin carbon film between the copper wire and the t...