APA (7th ed.) Citation

Chang, C., Wang, D., Li, T., Shen, C., Jing, Y., Wu, G., & Lin, J. (2019). Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects. Journal of materials engineering and performance, 28(4), 2292-2304. https://doi.org/10.1007/s11665-019-03976-6

Chicago Style (17th ed.) Citation

Chang, Chang-Shuo, Da-Jiun Wang, Tse-Chang Li, Chang-Hong Shen, Yuan-Chou Jing, Gien-Huang Wu, and Jen-Fin Lin. "Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects." Journal of Materials Engineering and Performance 28, no. 4 (2019): 2292-2304. https://doi.org/10.1007/s11665-019-03976-6.

MLA (9th ed.) Citation

Chang, Chang-Shuo, et al. "Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects." Journal of Materials Engineering and Performance, vol. 28, no. 4, 2019, pp. 2292-2304, https://doi.org/10.1007/s11665-019-03976-6.