APA (7th ed.) Citation

Ding, Z., Teng, Y., Guo, W., Wu, C., & Liang, S. Y. (2024). Investigations on material removal mechanism during laser-assisted grinding silicon nitride ceramics. International journal of advanced manufacturing technology, 132(9-10), 4345-4362. https://doi.org/10.1007/s00170-024-13622-8

Chicago Style (17th ed.) Citation

Ding, Zishan, Yikang Teng, Weicheng Guo, Chongjun Wu, and Steven Y. Liang. "Investigations on Material Removal Mechanism During Laser-assisted Grinding Silicon Nitride Ceramics." International Journal of Advanced Manufacturing Technology 132, no. 9-10 (2024): 4345-4362. https://doi.org/10.1007/s00170-024-13622-8.

MLA (9th ed.) Citation

Ding, Zishan, et al. "Investigations on Material Removal Mechanism During Laser-assisted Grinding Silicon Nitride Ceramics." International Journal of Advanced Manufacturing Technology, vol. 132, no. 9-10, 2024, pp. 4345-4362, https://doi.org/10.1007/s00170-024-13622-8.