An Investigation of Fatigue Characteristics of Copper Film

• Published in: Experimental mechanics Vol. 51; no. 7; pp. 1033 - 1038
• Main Authors: Huh, Y. H., Kim, D. I., Kim, D. J., Lee, H. M., Hong, S. G., Park, J. H.
• Format: Journal Article
• Language: English
• Published: Boston Springer US 01.09.2011; Springer
• Subjects: Biomedical Engineering and Bioengineering; Characterization and Evaluation of Materials; Control; Dynamical Systems; Electron, positron and ion microscopes, electron diffractometers and related techniques; Engineering; Exact sciences and technology; Fracture mechanics (crack, fatigue, damage...); Fundamental areas of phenomenology (including applications); Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Lasers; Measurement and testing methods; Optical Devices; Optics; Photonics; Physics; Solid Mechanics; Structural and continuum mechanics; Vibration; ESPI technique; S-N curve; Fatigue limit; Load ratio; Copper film; Tensile properties; Cyclic loads; Ultimate limit; Chemical etching; Coatings; Fatigue fracture; Speckles; Load control; Copper; Electronic speckle pattern interferometry; Stress measurement; Light interferometry; Scanning electron microscopy; Fatigue testing; Tensile tests; Fatigue; Layer thickness; Optical measurement; Fracture surfaces; Ductile fracture; Microstructure; Fractography

Tensile and fatigue behaviors of the copper film coated by tin (Sn) were investigated considering S-N relationships and scanning electron microscope (SEM) observation of fracture surfaces. The fatigue behavior was investigated considering the effect of load ratio, R. The specimen of 2000 μm width, 8...