An Investigation of Fatigue Characteristics of Copper Film
Tensile and fatigue behaviors of the copper film coated by tin (Sn) were investigated considering S-N relationships and scanning electron microscope (SEM) observation of fracture surfaces. The fatigue behavior was investigated considering the effect of load ratio, R. The specimen of 2000 μm width, 8...
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Published in | Experimental mechanics Vol. 51; no. 7; pp. 1033 - 1038 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
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01.09.2011
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Abstract | Tensile and fatigue behaviors of the copper film coated by tin (Sn) were investigated considering S-N relationships and scanning electron microscope (SEM) observation of fracture surfaces. The fatigue behavior was investigated considering the effect of load ratio, R. The specimen of 2000 μm width, 8000 μm length and 15.26 μm thickness was fabricated by etching process. Tensile properties were measured using the micro-tensile testing system and in-plane electronic speckle pattern interferometric (ESPI) system for measuring the tensile strain during the test. The fatigue tests of the film were carried out in load-control mode with 40 Hz at three different stress ratios of 0.05, 0.3 and 0.5. The S-N curves, including the slope of the curve and fatigue limit, at the respective stress ratios were obtained. These curves were dependent on the load ratio. Empirical relationships indicating the dependency of the fatigue limit and S-N curve on the load ratio were suggested in this study. SEM observation of the tensile fracture surface showed that the cross-sectional area of the testing section was necked in the direction of the film thickness (i.e. parallel to the substrate surface normal) and some ductile dimples in the fracture surface were present. The fracture of the copper film under cyclic loading was progressed in the transgranular fracture mode. |
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AbstractList | Tensile and fatigue behaviors of the copper film coated by tin (Sn) were investigated considering S-N relationships and scanning electron microscope (SEM) observation of fracture surfaces. The fatigue behavior was investigated considering the effect of load ratio, R. The specimen of 2000 μm width, 8000 μm length and 15.26 μm thickness was fabricated by etching process. Tensile properties were measured using the micro-tensile testing system and in-plane electronic speckle pattern interferometric (ESPI) system for measuring the tensile strain during the test. The fatigue tests of the film were carried out in load-control mode with 40 Hz at three different stress ratios of 0.05, 0.3 and 0.5. The S-N curves, including the slope of the curve and fatigue limit, at the respective stress ratios were obtained. These curves were dependent on the load ratio. Empirical relationships indicating the dependency of the fatigue limit and S-N curve on the load ratio were suggested in this study. SEM observation of the tensile fracture surface showed that the cross-sectional area of the testing section was necked in the direction of the film thickness (i.e. parallel to the substrate surface normal) and some ductile dimples in the fracture surface were present. The fracture of the copper film under cyclic loading was progressed in the transgranular fracture mode. |
Author | Kim, D. J. Huh, Y. H. Park, J. H. Lee, H. M. Kim, D. I. Hong, S. G. |
Author_xml | – sequence: 1 givenname: Y. H. surname: Huh fullname: Huh, Y. H. email: yhhuh@kriss.re.kr organization: Center for New and Renewable Energy Measurement, Division of Industrial Metrology, Korea Research Institute of Standards and Science – sequence: 2 givenname: D. I. surname: Kim fullname: Kim, D. I. organization: Center for New and Renewable Energy Measurement, Division of Industrial Metrology, Korea Research Institute of Standards and Science – sequence: 3 givenname: D. J. surname: Kim fullname: Kim, D. J. organization: Center for New and Renewable Energy Measurement, Division of Industrial Metrology, Korea Research Institute of Standards and Science – sequence: 4 givenname: H. M. surname: Lee fullname: Lee, H. M. organization: Center for New and Renewable Energy Measurement, Division of Industrial Metrology, Korea Research Institute of Standards and Science – sequence: 5 givenname: S. G. surname: Hong fullname: Hong, S. G. organization: Center for New and Renewable Energy Measurement, Division of Industrial Metrology, Korea Research Institute of Standards and Science – sequence: 6 givenname: J. H. surname: Park fullname: Park, J. H. organization: Department of Mechatronics Engineering, Tongmyong University |
BackLink | http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=24537736$$DView record in Pascal Francis |
BookMark | eNp9j0FLwzAYhoNMcJv-AG-9eIzmS9Ik9TaKm4OBFz2HNE1mx5aWpBP892ZUPHr6Pnjf54VngWahDw6heyCPQIh8SgCME0yA4IoDxdUVmoPkgKkU5QzNCQGOuSrhBi1SOpDMMEnn6HkVim34cmns9mbs-lD0vljnb392Rf1porGji12ObbpEdT8MLhbr7ni6RdfeHJO7-71L9LF-ea9f8e5ts61XO2wZqBE72lrlRdsob0rfKMGFot5ZKBkHXzHSGKa4t6L1lLTWgCemodIoKxruBWdLBNOujX1K0Xk9xO5k4rcGoi_yepLXWV5f5HWVmYeJGUyy5uijCbZLfyDlJZOSidyjUy_lKOxd1If-HEPW-Wf8B1LHa3Y |
CODEN | EXMCAZ |
CitedBy_id | crossref_primary_10_1016_j_tsf_2016_09_018 crossref_primary_10_1115_1_4025319 crossref_primary_10_1016_j_ijfatigue_2020_106108 crossref_primary_10_1177_1687814018776135 crossref_primary_10_1155_2022_9663767 |
Cites_doi | 10.1016/S1359-6454(99)00294-3 10.1557/JMR.2005.0019 10.1002/1527-2648(200103)3:3<99::AID-ADEM99>3.0.CO;2-2 10.4028/www.scientific.net/KEM.345-346.1115 10.1016/S0167-6636(03)00027-9 10.1146/annurev.ms.26.080196.002243 10.4028/www.scientific.net/KEM.270-273.744 10.1016/j.msea.2007.06.092 10.1002/mawe.200700262 10.1557/PROC-518-81 10.3139/146.020392 10.1007/BF02666659 |
ContentType | Journal Article |
Copyright | Society for Experimental Mechanics 2010 2015 INIST-CNRS |
Copyright_xml | – notice: Society for Experimental Mechanics 2010 – notice: 2015 INIST-CNRS |
DBID | IQODW AAYXX CITATION |
DOI | 10.1007/s11340-010-9412-9 |
DatabaseName | Pascal-Francis CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Physics |
EISSN | 1741-2765 |
EndPage | 1038 |
ExternalDocumentID | 10_1007_s11340_010_9412_9 24537736 |
GroupedDBID | -5B -5G -BR -EM -XX -Y2 -~C -~X .4S .86 .DC .VR 06D 0R~ 0VY 199 1N0 1SB 2.D 203 28- 29G 29~ 2J2 2JN 2JY 2KG 2KM 2LR 2VQ 2~H 30V 4.4 406 408 40D 40E 5GY 5VS 67Z 6NX 6TJ 78A 8TC 8UJ 95- 95. 95~ 96X AAAVM AABHQ AABYN AAFGU AAHNG AAIAL AAJKR AANZL AAPBV AARHV AARTL AATNV AATVU AAUYE AAWCG AAYFA AAYIU AAYQN AAYTO ABBBX ABDEX ABDZT ABECU ABFGW ABFSI ABFTD ABFTV ABHLI ABHQN ABJNI ABJOX ABKAG ABKAS ABKCH ABKTR ABMNI ABMQK ABNWP ABPTK ABQBU ABSXP ABTEG ABTHY ABTKH ABTMW ABULA ABWNU ABXPI ACBEA ACBMV ACBRV ACBXY ACBYP ACGFO ACGFS ACHSB ACHXU ACIGE ACIPQ ACIWK ACKNC ACMDZ ACMLO ACOKC ACOMO ACREN ACTTH ACVWB ACWMK ADHHG ADHIR ADINQ ADKNI ADKPE ADMDM ADMVV ADOXG ADRFC ADTPH ADURQ ADYFF ADYOE ADZKW AEBTG AEEQQ AEFTE AEGAL AEGNC AEGXH AEJHL AEJRE AEKMD AEKVL AENEX AEOHA AEPYU AESKC AESTI AETLH AEVLU AEVTX AEXYK AFDAS AFEXP AFFNX AFGCZ AFLOW AFNRJ AFQWF AFWTZ AFYQB AFZKB AGAYW AGDGC AGGBP AGGDS AGJBK AGMZJ AGQMX AGWIL AGWZB AGYKE AHAVH AHBYD AHKAY AHSBF AHYZX AIAGR AIAKS AIDUJ AIIXL AILAN AIMYW AITGF AJBLW AJDOV AJRNO AJZVZ AKQUC ALMA_UNASSIGNED_HOLDINGS ALWAN AMKLP AMTXH AMXSW AMYLF AMYQR AOCGG ARCEE ARCSS ARMRJ ASPBG AVWKF AXYYD AYJHY AZFZN B-. BA0 BBWZM BDATZ BGNMA CAG COF CS3 CSCUP DDRTE DNIVK DPUIP DU5 E.L EBLON EBS EDO EIOEI EJD ESBYG F5P FEDTE FERAY FFXSO FIGPU FINBP FNLPD FRRFC FSGXE FWDCC G8K GGCAI GGRSB GJIRD GNWQR GQ6 GQ7 HF~ HG5 HG6 HMJXF HRMNR HVGLF HZ~ I-F IAO IEA IGS IJ- IKXTQ ITM IWAJR IXC IXE IZQ I~X J-C J0Z JBSCW JZLTJ KDC KOV LAS LLZTM M4V M4Y MA- N2Q N9A NB0 NDZJH NF0 NPVJJ NQJWS NU0 O9- O93 O9G O9I O9J P19 P2P P9P PF0 PT4 PT5 QF4 QM1 QN7 QO4 QOK QOS R4E R89 R9I RHV RIG RNI RNS ROL RPX RSV RZK S16 S1Z S26 S27 S28 S3B SAP SC5 SCLPG SCV SDH SDM SEG SHX SISQX SJYHP SNE SNPRN SNX SOHCF SOJ SPISZ SRMVM SSLCW STPWE SZN T13 T16 TAE TN5 TSG TSK TSV TUC TUS U2A UCJ UG4 UNUBA UOJIU UTJUX UZXMN VC2 VFIZW W23 W48 WH7 WK8 XSW YLTOR Z45 Z5O Z7R Z7S Z7V Z7W Z7X Z7Y Z7Z Z83 Z85 Z86 Z88 Z8M Z8N Z8P Z8Q Z8R Z8S Z8T Z8W Z8Z Z92 ZMTXR _50 ~EX 08R H13 IQODW AACDK AAEOY AAJBT AASML AAYXX ABAKF ACAOD ACDTI ACZOJ AEFQL AEMSY AFBBN AGQEE AGRTI AIGIU CITATION |
ID | FETCH-LOGICAL-c318t-e2dc8f6db8fa5fb864682fec15341f930ba384fc6df20dca1f0ab27a8c6b4f643 |
IEDL.DBID | AGYKE |
ISSN | 0014-4851 |
IngestDate | Thu Sep 12 17:30:16 EDT 2024 Sun Oct 29 17:06:58 EDT 2023 Sat Dec 16 12:04:34 EST 2023 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 7 |
Keywords | ESPI technique S-N curve Fatigue limit Load ratio Copper film Tensile properties Cyclic loads Ultimate limit Chemical etching Coatings Fatigue fracture Speckles Load control Copper Electronic speckle pattern interferometry Stress measurement Light interferometry Scanning electron microscopy Fatigue testing Tensile tests Fatigue Layer thickness Optical measurement Fracture surfaces Ductile fracture Microstructure Fractography |
Language | English |
License | CC BY 4.0 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c318t-e2dc8f6db8fa5fb864682fec15341f930ba384fc6df20dca1f0ab27a8c6b4f643 |
PageCount | 6 |
ParticipantIDs | crossref_primary_10_1007_s11340_010_9412_9 pascalfrancis_primary_24537736 springer_journals_10_1007_s11340_010_9412_9 |
PublicationCentury | 2000 |
PublicationDate | 2011-09-01 |
PublicationDateYYYYMMDD | 2011-09-01 |
PublicationDate_xml | – month: 09 year: 2011 text: 2011-09-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | Boston |
PublicationPlace_xml | – name: Boston – name: Heidelberg |
PublicationSubtitle | An International Journal |
PublicationTitle | Experimental mechanics |
PublicationTitleAbbrev | Exp Mech |
PublicationYear | 2011 |
Publisher | Springer US Springer |
Publisher_xml | – name: Springer US – name: Springer |
References | Cornella, Vinci, Suryanarayanan, Dauskardt, Bravman (CR9) 1999; 518 Keller, Barbosa, Geiss, Read (CR10) 2007; 345–346 Park, An, Kim, Huh, Lee (CR12) 2008; 39 Vinci, Vlassak (CR3) 1996; 26 Kraft, Volkert (CR4) 2001; 3 Zhang, Volkert, Schwaiger, Arzt, Kraft (CR6) 2005; 20 Wang, Volkert, Kraft (CR7) 2008; 493 CR11 Nix (CR2) 1989; 20A Kraft, Wellner, Hommel, Schwaiger, Arzt (CR8) 2002; 93 Huh, Kim, Kim, Park, Kee, Park (CR13) 2004; 270 Sharpe, Bagdahn (CR5) 2004; 36 Spearing (CR1) 2000; 48 RR Keller (9412_CR10) 2007; 345–346 O Kraft (9412_CR4) 2001; 3 WD Nix (9412_CR2) 1989; 20A 9412_CR11 Y-H Huh (9412_CR13) 2004; 270 RP Vinci (9412_CR3) 1996; 26 SM Spearing (9412_CR1) 2000; 48 J-H Park (9412_CR12) 2008; 39 WN Sharpe (9412_CR5) 2004; 36 O Kraft (9412_CR8) 2002; 93 D Wang (9412_CR7) 2008; 493 G Cornella (9412_CR9) 1999; 518 GP Zhang (9412_CR6) 2005; 20 |
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SSID | ssj0007372 |
Score | 2.0083606 |
Snippet | Tensile and fatigue behaviors of the copper film coated by tin (Sn) were investigated considering S-N relationships and scanning electron microscope (SEM)... |
SourceID | crossref pascalfrancis springer |
SourceType | Aggregation Database Index Database Publisher |
StartPage | 1033 |
SubjectTerms | Biomedical Engineering and Bioengineering Characterization and Evaluation of Materials Control Dynamical Systems Electron, positron and ion microscopes, electron diffractometers and related techniques Engineering Exact sciences and technology Fracture mechanics (crack, fatigue, damage...) Fundamental areas of phenomenology (including applications) Instruments, apparatus, components and techniques common to several branches of physics and astronomy Lasers Measurement and testing methods Optical Devices Optics Photonics Physics Solid Mechanics Structural and continuum mechanics Vibration |
Title | An Investigation of Fatigue Characteristics of Copper Film |
URI | https://link.springer.com/article/10.1007/s11340-010-9412-9 |
Volume | 51 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwED71sYAQb0R5VBmYQKkSx3EStqhqqEAwUalMke3YCBWSqE0Xfj12k_ShwsAWyYklf7HvPvnuvgO44YIEUrkSk2udIZwEtskULzE9SokkAbMtqouTn1_IcIQfx-64AWh5dZFOenVEcmGoV7VutqMzEZXZCLCNzKAJbVfrfbWgHT68PQ2W9lc3XintLzaxIhR1LPO3STa80V5OZwoYWXa02AqNLjxOdFBWAc4WQoU60WTSmxesx7-3ZRz_sZhD2K8IqBGWO-YIGiI9ht01WcITuA9TY01_I0uNTBqRenqfC6O_qfCsh_pZnoupEX18fp3CKBq89odm1WPB5Oo0F6ZACfclSZgvqSuZTzDxkRRcGUJsy8CxGHV8LDlJJLISTm1pUYY86nPCsFR05gxaaZaKczCYdC1HEIQktTGiHg10x7-EK0ZIqEuTDtzWWMd5KaURr0STNSCxAiTWgMRBB7obf2P5BcKu43kO6cBdDW1cHbvZ39Nd_OvtS9gpr451KtkVtIrpXFwr7lGwbrXZutAcofAHnVbP1w |
link.rule.ids | 315,786,790,27955,27956,41114,41556,42183,42625,52144,52267 |
linkProvider | Springer Nature |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3JTsMwEB1BewCE2BFlKTlwAgUljuMk3KqqodDl1ErlFNmOjRCQVF0ufD12k3RhOfQWyYnlvNgzT5mZNwA3XJBAKldicq0zhOPANpniJaZHKZEkYLZFdXFyp0uaffw8cAd5Hfe4yHYvQpIzS70odrMdnYqo7EaAbWQGm1DG2sGXoFx7fGk15gZYd17JDDA2sWIURTDzr0lW3NHukI4VMjJrafErNjpzOeE-9IrFZpkm7_fTCbvnXz90HNd8mwPYyymoUcv2zCFsiOQIdpaECY_hoZYYSwocaWKk0gjV1etUGPVVjWc9VE-HQzEywrePzxPoh41evWnmXRZMrs7zxBQo5r4kMfMldSXzCSY-koIrU4htGTgWo46PJSexRFbMqS0typBHfU4YlorQnEIpSRNxBgaTruUIgpCkNkbUo4Hu-RdzxQkJdWlcgdsC7GiYiWlEC9lkDUikAIk0IFFQgerK55g_gbDreJ5DKnBXQBvlB2_8_3Tna919DVvNXqcdtZ-6rQvYzn4k68SySyhNRlNxpZjIhFXznfcNBXnSwg |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LS8NAEF60gigiPrE-ag6elKXJZrNJvJVqqK_iwUJvYV8jgiahTf-_u03TB-rBWyDJHr7sznxkZr4PoSupWQwmlWBpdYaoij0sDC_BIecMWCw8l9vh5Jc-6w3o4zAYznxOx3W3e12SrGYarEpTVrYLBe3F4Jvn27ZEE0Ni6hEcr6MNmxntFh-QzjwUWw-WKhRTTA23qMuavy2xkph2Cj42GEFlbvGjSjpNPske2p2xRqdTfeZ9tKazA7S9pCV4iG47mbMkmpFnTg5OYq7eJ9rprsoy21vdvCj0yEk-Pr-O0CC5f-v28MwYAUtzBEusiZIRMCUi4AGIiFEWEdDSRC_qQey7gvsRBckUEFdJ7oHLBQl5JJmgYDjIMWpkeaZPkCMgcH3NCAHuUcJDHlubPiUNjWM84KqJrmtU0qLSv0gXSscWwtRAmFoI07iJWiu4zd8gNPDD0GdNdFMDmc7Oyvjv5U7_9fQl2ny9S9Lnh_7TGdqqfv3aVrBz1ChHE31huEMpWtP98Q1LSbpN |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=An+Investigation+of+Fatigue+Characteristics+of+Copper+Film&rft.jtitle=Experimental+mechanics&rft.au=Huh%2C+Y.+H.&rft.au=Kim%2C+D.+I.&rft.au=Kim%2C+D.+J.&rft.au=Lee%2C+H.+M.&rft.date=2011-09-01&rft.issn=0014-4851&rft.eissn=1741-2765&rft.volume=51&rft.issue=7&rft.spage=1033&rft.epage=1038&rft_id=info:doi/10.1007%2Fs11340-010-9412-9&rft.externalDBID=n%2Fa&rft.externalDocID=10_1007_s11340_010_9412_9 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0014-4851&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0014-4851&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0014-4851&client=summon |