APA (7th ed.) Citation

Flötgen, C., Pawlak, M., Pabo, E., van de Wiel, H. J., Hayes, G. R., & Dragoi, V. (2014). Wafer bonding using Cu–Sn intermetallic bonding layers. Microsystem technologies : sensors, actuators, systems integration, 20(4-5), 653-662. https://doi.org/10.1007/s00542-013-2002-x

Chicago Style (17th ed.) Citation

Flötgen, C., M. Pawlak, E. Pabo, H. J. van de Wiel, G. R. Hayes, and V. Dragoi. "Wafer Bonding Using Cu–Sn Intermetallic Bonding Layers." Microsystem Technologies : Sensors, Actuators, Systems Integration 20, no. 4-5 (2014): 653-662. https://doi.org/10.1007/s00542-013-2002-x.

MLA (9th ed.) Citation

Flötgen, C., et al. "Wafer Bonding Using Cu–Sn Intermetallic Bonding Layers." Microsystem Technologies : Sensors, Actuators, Systems Integration, vol. 20, no. 4-5, 2014, pp. 653-662, https://doi.org/10.1007/s00542-013-2002-x.