On blockchain and its integration with IoT. Challenges and opportunities

In the Internet of Things (IoT) vision, conventional devices become smart and autonomous. This vision is turning into a reality thanks to advances in technology, but there are still challenges to address, particularly in the security domain e.g., data reliability. Taking into account the predicted e...

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Bibliographic Details
Published inFuture generation computer systems Vol. 88; pp. 173 - 190
Main Authors Reyna, Ana, Martín, Cristian, Chen, Jaime, Soler, Enrique, Díaz, Manuel
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.11.2018
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Summary:In the Internet of Things (IoT) vision, conventional devices become smart and autonomous. This vision is turning into a reality thanks to advances in technology, but there are still challenges to address, particularly in the security domain e.g., data reliability. Taking into account the predicted evolution of the IoT in the coming years, it is necessary to provide confidence in this huge incoming information source. Blockchain has emerged as a key technology that will transform the way in which we share information. Building trust in distributed environments without the need for authorities is a technological advance that has the potential to change many industries, the IoT among them. Disruptive technologies such as big data and cloud computing have been leveraged by IoT to overcome its limitations since its conception, and we think blockchain will be one of the next ones. This paper focuses on this relationship, investigates challenges in blockchain IoT applications, and surveys the most relevant work in order to analyze how blockchain could potentially improve the IoT. •Challenges to address the integration of the IoT with blockchain.•Analysis of blockchain potential benefits for the IoT.•Blockchain IoT applications and platforms for the development of IoT solutions.•Possible topologies to that integration.•Evaluation of blockchain nodes in IoT devices.
ISSN:0167-739X
1872-7115
DOI:10.1016/j.future.2018.05.046