APA (7th ed.) Citation

Zheng, Y., Liu, H., Yan, L., Yang, H., Dai, L., & Si, C. (2024). Lignin‐Based Encapsulation of Liquid Metal Particles for Flexible and High‐Efficiently Recyclable Electronics. Advanced functional materials, 34(7), -n/a. https://doi.org/10.1002/adfm.202310653

Chicago Style (17th ed.) Citation

Zheng, Yong, Hai Liu, Li Yan, Haiyue Yang, Lin Dai, and Chuanling Si. "Lignin‐Based Encapsulation of Liquid Metal Particles for Flexible and High‐Efficiently Recyclable Electronics." Advanced Functional Materials 34, no. 7 (2024): -n/a. https://doi.org/10.1002/adfm.202310653.

MLA (9th ed.) Citation

Zheng, Yong, et al. "Lignin‐Based Encapsulation of Liquid Metal Particles for Flexible and High‐Efficiently Recyclable Electronics." Advanced Functional Materials, vol. 34, no. 7, 2024, pp. -n/a, https://doi.org/10.1002/adfm.202310653.