刘伟娟, 蒋. 刘. 袁. 陈. (2014). Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration. Journal of semiconductors, 35(11), 173-178. https://doi.org/10.1088/1674-4926/35/11/116002
Chicago Style (17th ed.) Citation刘伟娟, 蒋勐婷 刘玉岭 袁浩博 陈国栋. "Evaluation of Planarization Performance for a Novel Alkaline Copper Slurry Under a Low Abrasive Concentration." Journal of Semiconductors 35, no. 11 (2014): 173-178. https://doi.org/10.1088/1674-4926/35/11/116002.
MLA (9th ed.) Citation刘伟娟, 蒋勐婷 刘玉岭 袁浩博 陈国栋. "Evaluation of Planarization Performance for a Novel Alkaline Copper Slurry Under a Low Abrasive Concentration." Journal of Semiconductors, vol. 35, no. 11, 2014, pp. 173-178, https://doi.org/10.1088/1674-4926/35/11/116002.
Warning: These citations may not always be 100% accurate.