Study on the material removal mechanism and the exit breakage of ultrasonic vibration-assisted grinding for microcrystalline glass

• Published in: Discover Applied Sciences Vol. 6; no. 3; p. 133
• Main Authors: Zhang, Wenchao, Cui, Enming, Zhang, Baoquan, Wang, Mingwei, Zhao, Xiujun
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 14.03.2024; Springer Nature B.V
• Subjects: Applied and Technical Physics; Breakage; Brittle materials; Chemistry/Food Science; Constitutive models; Diamond machining; Diamonds; Earth Sciences; Edge stresses; Engineering; Environment; Feed rate; Finite element method; Grinding; Grit; Materials Science; Mathematical models; Microcracks; Morphology; Process parameters; Simulation; Simulation models; Software; Surface properties; Surface roughness; Trajectory analysis; Ultrasonic vibration; Vibration; Vibration analysis; White light; Workpieces; Surface quality; Microcrystalline glass; Exit breakage; Process parameters; Grinding force

With the aim of solving problems such as exit breakage and surface microcracks during microcrystalline glass machining, an ellipsoidal erosion model is established by analyzing the motion trajectory and characteristics of single diamond grit in ultrasonic vibration-assisted grinding (UVAG), and the...