APA (7th ed.) Citation

Qu, Y., Jin, F., & Yang, J. (2021). Temperature Effects on Mobile Charges in Thermopiezoelectric Semiconductor Plates. International journal of applied mechanics, 13(3), 2150037. https://doi.org/10.1142/S175882512150037X

Chicago Style (17th ed.) Citation

Qu, Yilin, Feng Jin, and Jiashi Yang. "Temperature Effects on Mobile Charges in Thermopiezoelectric Semiconductor Plates." International Journal of Applied Mechanics 13, no. 3 (2021): 2150037. https://doi.org/10.1142/S175882512150037X.

MLA (9th ed.) Citation

Qu, Yilin, et al. "Temperature Effects on Mobile Charges in Thermopiezoelectric Semiconductor Plates." International Journal of Applied Mechanics, vol. 13, no. 3, 2021, p. 2150037, https://doi.org/10.1142/S175882512150037X.