Thermal simulation of flexible LED package enhanced with copper pillars - 刘洋 梁润园 黄洁莹 袁长安 张国旗 孙凤莲 (Journal of semiconductors, 2015)
Keywords: Chips; COF; Copper; DIODES; Heat transfer; LED; Light-emitting diodes; MATHEMATICAL ANALYSIS; Packages; PACKAGING; POLYIMIDES; SEMICONDUCTORS; Thermal resistance; 发光二极管; 封装技术; 有限元分析; 热仿真; 芯片温度; 铜柱