Effect of In Diffusion on the Property of Blue Light-Emitting Diodes

In diffusion to blue light-emitting diode (LED) wafers is performed by the inductive coupled plasma (ICP) treatment of a covering layer of indium tin oxide (ITO) on the wafer surface. The electrical property of the p- type contact is improved and the redshift of photoluminescence (PL) from the InGaN...

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Bibliographic Details
Published inChinese physics letters Vol. 32; no. 6; pp. 80 - 83
Main Author 曾勇平 刘文杰 翁国恩 赵婉茹 左海杰 余健 张江勇 应磊莹 张保平
Format Journal Article
LanguageEnglish
Published 01.06.2015
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ISSN0256-307X
1741-3540
DOI10.1088/0256-307X/32/6/064207

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Summary:In diffusion to blue light-emitting diode (LED) wafers is performed by the inductive coupled plasma (ICP) treatment of a covering layer of indium tin oxide (ITO) on the wafer surface. The electrical property of the p- type contact is improved and the redshift of photoluminescence (PL) from the InGaN quantum well of the wafer is found. Measurements by x-ray photoelectron spectroscopy (XPS) demonstrate that In atoms have diffused into p-GaN. Reflectance spectra of the sample surface reveal the variation caused by the ICP treatment. A model of compensation of the in-plane strain of the InGaN layer is used to explain the redshift of the PL data. Finally, LEDs are fabricated by using as-grown and ICP-treated wafers and their properties are compared. Under an injection current of 20mA, LEDs with ICP-induced In doping show a decrease of 0.3 V in the forward voltage and an increase of 23% in the light output, respectively.
Bibliography:ZENG Yong-Ping, LIU Wen-Jie, WENG Guo-En, ZHAO Wan-Ru, ZUO Hai-Jie, YU Jian, ZHANG Jiang-Yong, YING Lei-Ying, ZHANG Bao-Ping(1Optoelectronics Engineering Research Center, Department of Electronic Engineering, Xiamen University, Xiamen 361005; 2Department of Physics, Xiamen University, Xiamen 361005)
11-1959/O4
In diffusion to blue light-emitting diode (LED) wafers is performed by the inductive coupled plasma (ICP) treatment of a covering layer of indium tin oxide (ITO) on the wafer surface. The electrical property of the p- type contact is improved and the redshift of photoluminescence (PL) from the InGaN quantum well of the wafer is found. Measurements by x-ray photoelectron spectroscopy (XPS) demonstrate that In atoms have diffused into p-GaN. Reflectance spectra of the sample surface reveal the variation caused by the ICP treatment. A model of compensation of the in-plane strain of the InGaN layer is used to explain the redshift of the PL data. Finally, LEDs are fabricated by using as-grown and ICP-treated wafers and their properties are compared. Under an injection current of 20mA, LEDs with ICP-induced In doping show a decrease of 0.3 V in the forward voltage and an increase of 23% in the light output, respectively.
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ISSN:0256-307X
1741-3540
DOI:10.1088/0256-307X/32/6/064207