Quantitative analysis of the polishing performance of Wurtzite-SiC surface texture on surface quality and material removal rate

Molecular dynamics simulation is used to study Wurtzite-SiC's structural changes after polishing process. For realistic planarization conditions, various surface-textured structures are also used. Polishing speed greatly impacts dislocation distribution. Increasing velocity to 2 Å/ps reduces di...

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Bibliographic Details
Published inTribology international Vol. 199; p. 110020
Main Authors Do, Tan-Tai, Le, Phu-Cuong, Fang, Te-Hua
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.11.2024
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