Torisaki, M., Shimoda, M., & Ali, M. A. (2024). Micro shape optimization for minimizing microstructural thermal-stress considering heat conduction. International journal of mechanical sciences, 274, 109268. https://doi.org/10.1016/j.ijmecsci.2024.109268
Chicago Style (17th ed.) CitationTorisaki, Mihiro, Masatoshi Shimoda, and Musaddiq Al Ali. "Micro Shape Optimization for Minimizing Microstructural Thermal-stress Considering Heat Conduction." International Journal of Mechanical Sciences 274 (2024): 109268. https://doi.org/10.1016/j.ijmecsci.2024.109268.
MLA (9th ed.) CitationTorisaki, Mihiro, et al. "Micro Shape Optimization for Minimizing Microstructural Thermal-stress Considering Heat Conduction." International Journal of Mechanical Sciences, vol. 274, 2024, p. 109268, https://doi.org/10.1016/j.ijmecsci.2024.109268.